S-EEG Electrode ASIC Integration for Low-Noise Signal Readout

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Solution Overview

Problem

Existing multi-contact electrodes for S-EEG suffer from weak electric signal transmission due to thin conductors, interference from unwanted signals, and limitations in the number of conductors that can be accommodated, particularly in thermocoagulation procedures.

Innovation Solution

A multi-contact electrode with an integrated circuit that amplifies and digitizes electrical signals at the distal end, incorporating a thermocoagulation unit, digital communication interface, and a compact integrated circuit, reducing the need for external processing and minimizing noise interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If thin conductors are used to transmit electric signals from the electrode, then the electrode structure remains compact and minimally invasive, but the signal quality deteriorates due to noise interference and power losses

Engineering Contradiction:
Improvenoise interferenceVSAvoidexternal processing equipment
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines the signal processing functions (amplification, filtering, digitization) that were previously located externally with the electrode itself, creating an integrated system. This merging eliminates the need for thin external conductors to carry weak analog signals over long distances, thereby reducing noise interference while maintaining a compact structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces an intermediate processing stage at the electrode tip that converts weak analog bioelectric signals into robust digital signals before transmission. This intermediary conversion process acts as a buffer against noise interference, allowing the use of simpler, more robust conductors while maintaining signal integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If the number of conductors is increased to accommodate more recording sites, then the channel capacity increases, but the catheter gauge and device size must be increased

Engineering Contradiction:
Improvechannel capacityVSAvoidcatheter gauge
Core Design Contradiction:
ProductivityVSLength of moving object

Solution Approach 1:

The patent merges multiple signal processing channels into a single integrated circuit package at the electrode tip. This consolidation allows multiple recording sites to be served by a limited number of conductors, as the integrated circuit can handle multiple channels internally without requiring proportional increases in external wiring.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from analog signal transmission to digital signal transmission, effectively adding a new dimension to the signal processing architecture. This dimensional change allows compact encoding and transmission of multiple channel signals through fewer conductors, as digital signals can be multiplexed and compressed more efficiently than analog signals.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Object-affected harmful factors

If thin wires are used for signal transmission, then the electrode remains minimally invasive, but the wires are unsuitable for carrying RF current needed in thermocoagulation procedures

Engineering Contradiction:
Improvetissue damage from thick wiresVSAvoidthermocoagulation capability
Core Design Contradiction:
Object-affected harmful factorsVSAdaptability or versatility

Solution Approach 1:

The patent combines the EEG recording function and thermocoagulation function into a single integrated electrode system. The integrated circuit manages both functions, allowing the use of a unified conductor design that can handle both low-power signal transmission and high-power RF delivery without requiring separate wire systems.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements dynamic switching within the integrated circuit that allows the same contact to be used for different purposes (signal recording or RF delivery) at different times. This dynamic allocation of conductor function eliminates the need for permanently thick wires, as the conductors only need to handle high current temporarily during thermocoagulation procedures.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated circuit processes signals robustly in a digital format, reducing noise and power losses, allowing for a simplified external setup and increased channel capacity without the need for multiple wires.

Implementation Method 1

a readout unit with a plurality of input channels, configured for amplifying and digitizing electrical signal impressed on at least some of the pick-up contacts

Methodology Applied
Scientific EffectSignal amplification:

Implementation Method 2

a thermocoagulation unit receiving a radiofrequency signal, selectively connectable to at least one selected contact out of the pick-up contacts for injecting a localized radiofrequency current into the target region

Methodology Applied
Scientific EffectRadiofrequency heating: Dielectric Heating

Data Source

PatentUS20260083494A1Multi-contact electrode and integrated circuit for s-eeg
Publication Date: 2026.03.26 ADEPT NEURO SA
  • US20260083494A1 patent drawing
  • US20260083494A1 patent drawing
  • US20260083494A1 patent drawing

AI summary

A multi-contact electrode device, comprising an elongated body with plurality of pick-up contacts and a slender ASIC into a hollow lumen. The ASIC is configured to readout, process and digitize the EEG signals present at the contacts and to apply selectively a high RF current to any selected pair of contacts for thermocoagulation. The ASIC also includes a microcontroller with a digital communication interface.