Segmented Adhesive Layout for Semiconductor Device Transfer
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Solution Overview
Problem
The existing manufacturing process for semiconductor devices, such as LEDs, requires a long etching time to remove adhesive between adjacent devices, leading to time-consuming processes, reduced yield, and potential misalignment or shifting of devices due to heat generation.
Innovation Solution
A semiconductor device arrangement structure and manufacturing method that involve a carrier with separate adhesive parts for each semiconductor device, allowing for efficient transfer and alignment without the need for extensive etching, thereby reducing processing time and preventing device misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a continuous adhesive layer is used to fix semiconductor devices to the carrier, then the devices can be securely attached, but extensive etching is required to remove adhesive between adjacent devices, leading to long processing times and potential device misalignment
Solution Approach 1:
The continuous adhesive layer is segmented into discrete adhesive parts, each positioned under a specific semiconductor device. This segmentation eliminates the need for extensive etching between adjacent devices, as the adhesive is already separated into distinct regions. The segmentation principle directly resolves the contradiction by maintaining secure attachment (through adequate adhesive coverage) while eliminating time-consuming etching processes.
Solution Approach 2:
The adhesive layer is pre-patterned into discrete adhesive parts before the semiconductor devices are transferred to the carrier. This preliminary action of creating separated adhesive regions eliminates the subsequent need for etching to remove adhesive between devices. By performing the separation action in advance, the process avoids long etching times and potential device misalignment.
2Reliability
If a continuous adhesive layer is used to fix semiconductor devices to the carrier, then the devices can be securely attached, but the etching process generates heat that causes devices to tilt or shift
Solution Approach 1:
By segmenting the adhesive layer into discrete adhesive parts positioned under each device, the invention eliminates the need for etching between adjacent devices. This removes the source of heat generation that causes device tilting and shifting, thereby maintaining manufacturing precision while still providing secure attachment through the segmented adhesive structure.
Solution Approach 2:
The invention extracts and removes the continuous adhesive layer between adjacent semiconductor devices, keeping only the discrete adhesive parts under each device. This extraction eliminates the harmful etching process and its associated heat generation that causes device misalignment, while preserving the necessary adhesive bonding for secure attachment.
3Loss of substance
If extensive etching is performed to remove adhesive between adjacent devices, then complete adhesive removal is achieved, but the manufacturing process becomes time-consuming and yield is reduced
Solution Approach 1:
The adhesive layer is pre-patterned into discrete adhesive parts before device transfer, eliminating the need for subsequent etching to remove adhesive between devices. This preliminary separation action achieves complete adhesive removal in the regions between devices without requiring time-consuming etching processes, thereby maintaining productivity.
Solution Approach 2:
The adhesive layer is segmented into discrete parts under each device, which automatically creates separation between adjacent devices. This segmentation achieves complete adhesive removal in the inter-device regions as a direct result of the segmentation structure itself, without requiring additional etching steps, thus maintaining high manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution significantly reduces the etching time and eliminates the risk of device misalignment, enhancing manufacturing efficiency and yield while maintaining the integrity of the semiconductor devices.
Implementation Method 1
heating the adhesive layer to transfer into a first adhesive part and a second adhesive part separated from the first adhesive part
Data Source
AI summary
A semiconductor device arrangement structure includes a carrier, a first semiconductor device, a second semiconductor device, a first adhesive part, and a second adhesive part. The first semiconductor device and the second semiconductor device are located on the carrier and separated from each other. The first adhesive part and the second adhesive part are separated from each other. The first adhesive part is located between the first semiconductor device and the carrier, and the second adhesive part is located between the second semiconductor device and the carrier. In a top view, the first adhesive part has a first outer contour surrounding the first semiconductor device. The first outer contour has at least one round corner.