Segmented Adhesive Layer for Semiconductor Alignment
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Solution Overview
Problem
The expansion and contraction of adhesive layers during temperature changes in semiconductor packaging processes lead to positional deviations of semiconductor elements, affecting alignment accuracy and product yield in flip-chip semiconductor packages.
Innovation Solution
A method involving the use of a polymer layer between the semiconductor element and the encapsulant, with the adhesive layer divided into separate units to prevent inter-unit interference, and a build-up structure formed on the exposed surface of the semiconductor element to ensure accurate positioning and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive layer is used to attach semiconductor elements to the carrier, then the semiconductor elements can be positioned and held in place, but the adhesive layer expands or contracts during temperature changes causing positional deviations
Solution Approach 1:
The adhesive layer is divided into multiple separate adhesive units (first adhesive unit, second adhesive unit, etc.) positioned at different locations. Each adhesive unit independently attaches the semiconductor element to the carrier without forming a continuous adhesive network. This segmentation prevents the adhesive layer from expanding or contracting as a unified structure during temperature changes, thereby eliminating the cause of positional deviations while maintaining effective attachment strength.
Solution Approach 2:
Different regions of the semiconductor element are attached using different adhesive units with potentially different properties or positions. The adhesive units are strategically placed at specific locations (e.g., corners or edges) rather than uniformly across the entire element, allowing localized attachment that accommodates thermal expansion differences without affecting overall alignment accuracy.
2Reliability
If the adhesive layer is continuous and covers the entire carrier surface, then complete coverage and support are provided, but thermal expansion and contraction cause deviations from predefined positions
Solution Approach 1:
The continuous adhesive layer is replaced by discrete segmented adhesive units distributed across the carrier surface. These separate units provide structural support and reliability through strategic placement while preventing the formation of a continuous adhesive network that would expand or contract uniformly with temperature changes, thereby maintaining position accuracy relative to predefined positions.
3Ease of manufacture
If semiconductor elements are disposed on adhesive layer at predefined positions, then proper spacing and arrangement are achieved, but thermal effects cause deviations from these predefined positions
Solution Approach 1:
The adhesive layer is segmented into multiple independent units that attach semiconductor elements at predefined positions without forming a continuous structure. This segmentation allows elements to be easily arranged at specific locations while preventing thermal expansion/contraction from causing deviations, as each adhesive unit acts independently rather than as a unified continuous layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents positional deviations during molding, enhancing alignment accuracy and improving product yield by fixing the semiconductor element's position and reducing the impact of adhesive layer expansion or contraction.
Implementation Method 1
the adhesive layer 32 easily expands or contracts when temperature changes during a molding process
Data Source
AI summary
A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.