Segmented Adhesive Tapes for Thin Glass Substrate Flexure
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Solution Overview
Problem
Thin glass substrates in display apparatuses are prone to structural weakness, leading to light leakages and COG mura due to local stress from adhesion forces and differing coefficients of expansion, which can result in cracks or breakage during impact.
Innovation Solution
The use of segmented double-sided adhesive tapes is implemented between the frame of a backlight module and the TFT array substrate, positioned at gaps between adjacent chips to reduce flexure and prevent light leakages and COG mura, with specific length adjustments to optimize adhesive tape placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a non-segmented double-sided adhesive tape is used to mount the glass substrate, then the mounting process is simple, but the glass substrate experiences local stress causing flexure and light leakages
Solution Approach 1:
The patent divides the continuous double-sided adhesive tape into multiple segmented adhesive tapes arranged in an array. Each segmented tape is positioned at specific locations corresponding to chip regions, while leaving gap regions between adjacent chips uncovered. This segmentation allows localized stress distribution, preventing the flexure and light leakages that occur with continuous adhesive tape while maintaining ease of manufacture through systematic placement.
2Length of moving object
If the glass substrate thickness is reduced to achieve thinner display apparatus, then the display thickness decreases, but the structural strength weakens making the substrate prone to cracks and breakage
Solution Approach 1:
The patent applies adhesive tapes selectively at specific locations (corresponding to chip regions) rather than uniformly across the entire glass substrate. This local quality approach concentrates adhesion force where needed for mounting stability while leaving gap regions between chips free from adhesive stress, thereby preventing stress-induced flexure and light leakages in thin glass substrates without requiring increased thickness.
3Reliability
If the glass substrate and chips are bonded together, then the assembly is secure, but the different coefficients of expansion cause flexure and COG mura
Solution Approach 1:
The patent extracts the adhesive application from continuous coverage and removes it specifically from the gap regions between adjacent chips. By taking out the adhesive tape from these critical gap areas while maintaining it at chip locations, the patent prevents the differential expansion stress from causing flexure and COG mura, while still ensuring secure bonding at the chip regions where adhesion is needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the JND value, indicating improved structural integrity and reduced COG mura, enhancing the display apparatus's durability and performance by minimizing light leakages and warpage.
Implementation Method 1
segmented double-sided adhesive tapes are stuck on a supporting surface of a frame of a backlight module
Data Source
AI summary
A display apparatus includes a backlight module, a panel module, and a plurality of double-sided adhesive tapes. The backlight module includes a bezel. The frame has a supporting surface. The panel module includes a glass substrate and a plurality of chips. The glass substrate is disposed on the supporting surface. An edge of the glass substrate has a bonding region. The chips are disposed at the bonding region. The chips and the supporting surface are respectively located at two opposite sides of the glass substrate. The double-sided adhesive tapes are disposed between the supporting surface and the bonding region. Each of the double-sided adhesive tapes is located at a gap between two adjacent chips.