Segmented Adhesive Attachment Structure for Void-Free Bonding

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Solution Overview

Problem

Conventional attachment structures, such as single-face and double-face adhesives, often fail to achieve full and planar attachment between substrate units due to the presence of voids and blisters, requiring skilled application and being non-reworkable.

Innovation Solution

An attachment structure featuring a main body with a first adhesive layer containing multiple passages that divide it into adhesive blocks or strips, allowing for air exhaustion and improved planarity without voids or crimps, facilitating quick and convenient attachment between substrate bodies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If plane adhesive is used for attachment, then the attachment structure can be simple in design, but voids and blisters occur leading to poor planarity

Engineering Contradiction:
Improveattachment structure designVSAvoidplanarity of attachment
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The adhesive layer is segmented into multiple discrete adhesive blocks arranged in an array, separated by gaps. This segmentation allows air to escape through the gaps during attachment, preventing voids and blisters while maintaining a simple overall structure. The adhesive blocks are positioned at specific intervals rather than forming a continuous layer.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If continuous adhesive layer is used, then full coverage is achieved, but air entrapment causes voids and blisters

Engineering Contradiction:
Improveadhesive coverage areaVSAvoidair entrapment and void formation
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The continuous adhesive layer is divided into discrete adhesive blocks with gaps between them. These gaps serve as air escape pathways during the attachment process, allowing trapped air to vent outward. This maintains adequate adhesive coverage for bonding while eliminating the harmful effect of air entrapment that causes voids and blisters.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The adhesive layer is designed with a porous or gap-filled structure rather than being completely solid and continuous. The gaps between adhesive blocks create a controlled porosity that facilitates air evacuation during attachment, preventing defect formation while preserving the necessary adhesive surface area for effective bonding.

Inventive Principle:
Principle #31Porous materials

3Manufacturing precision

If skilled application is required to avoid voids, then attachment quality can be improved, but the process becomes more complex and time-consuming

Engineering Contradiction:
Improveattachment quality without voidsVSAvoidattachment process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The adhesive block structure with integrated gaps performs the air evacuation function automatically during the attachment process itself. The design inherently provides air escape pathways without requiring additional tools, steps, or skilled manipulation. Attachments can be applied by simple pressing actions, and the structure self-manages the air removal that would otherwise require expert technique.

Inventive Principle:
Principle #25Self-service

4Productivity

If adhesive is used for one-time attachment only, then rework is impossible, but attachment speed can be maintained

Engineering Contradiction:
Improveattachment speedVSAvoidrework capability
Core Design Contradiction:
ProductivityVSEase of repair

Solution Approach 1:

The segmented adhesive block structure allows for controlled release and repositioning. The gaps between blocks reduce the overall bond strength slightly, enabling the attachment to be removed and reattached if needed, while still maintaining sufficient bonding strength for normal use. This provides rework capability without significantly compromising attachment speed or initial bonding performance.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables tight, planar attachment of substrate bodies without voids or blisters, simplifying the attachment process and ensuring high-quality bonding between multiple layers with reduced technical complexity and time.

Implementation Method 1

the air between the main body and the article can be exhausted so that the main body and the article can be more tightly attached to each other

Methodology Applied
Scientific EffectAir exhaustion:

Data Source

PatentUS11125267B2Attachment structure
Publication Date: 2021.09.21 ASIA VITAL COMPONENTS CO LTD
  • US11125267B2 patent drawing
  • US11125267B2 patent drawing
  • US11125267B2 patent drawing

AI summary

An attachment structure includes a main body and a first adhesive layer. The main body has an upper side as a first side and a lower side as a second side. The first adhesive layer is selectively disposed on one of the first and second sides. The first adhesive layer has multiple first passages. The first passages divide the first adhesive layer into multiple first adhesive blocks. By means of the first passages of the first adhesive layer, when the main body is attached to another unit, the main body can be more easily and tightly attached to the unit without producing any void or blister.