Segmented Adhesive Wafer for Ostomy Stress Distribution

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Solution Overview

Problem

Conventional adhesive wafers for ostomy appliances and wound dressings lack lateral flexibility, leading to discomfort, trauma, and increased risk of leakage due to stress concentration and limited mobility, especially under lateral movements.

Innovation Solution

An adhesive wafer design featuring a backing layer with independent first and second adhesive zones separated by a void volume, which acts as a buffer and leakage barrier, allowing for lateral flexibility and movement, and can incorporate different adhesives for enhanced performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the adhesive wafer is made with a continuous adhesive layer and backing layer, then the wafer provides secure skin attachment, but the wafer lacks lateral flexibility and transmits stress causing discomfort and trauma

Engineering Contradiction:
Improveskin attachment strengthVSAvoidlateral flexibility
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The adhesive wafer is divided into multiple independent adhesive zones (first adhesive zone, second adhesive zone, third adhesive zone) separated by void volumes. This segmentation allows each zone to move independently, providing lateral flexibility while maintaining secure skin attachment through the distributed adhesive zones. The void volumes act as buffers that absorb stress and prevent stress transmission across the entire wafer.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the adhesive wafer is made with a continuous adhesive layer, then the wafer provides complete skin coverage, but the wafer builds up tension leading to loosening of tack and increased risk of leakage

Engineering Contradiction:
Improveleakage preventionVSAvoidadhesive tack stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The continuous adhesive layer is segmented into multiple independent adhesive zones separated by void volumes. This segmentation reduces tension buildup within the adhesive layer while maintaining reliable leakage prevention. The void volumes act as stress-relief zones that prevent tension propagation, thereby maintaining adhesive tack stability over time.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different adhesive zones can incorporate different adhesives with varying properties optimized for their specific locations. This local quality approach allows each zone to perform its function optimally while the overall structure maintains reliability through the distributed zone configuration.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If the adhesive wafer is made with uniform thickness and structure, then the wafer is simple to manufacture, but the wafer cannot accommodate lateral movements or curved surfaces effectively

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidlateral movement accommodation
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The wafer structure is segmented into adhesive zones and void volumes, creating a modular design that is relatively simple to manufacture while providing adaptability. The void volumes can be created using standard manufacturing techniques such as punching or molding, and the adhesive zones can be applied using conventional adhesive lamination processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The wafer has varying local properties with adhesive zones providing attachment and void volumes providing flexibility. This local quality differentiation allows the wafer to accommodate lateral movements and curved surfaces effectively while maintaining manufacturing feasibility through standardized production methods.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design provides increased comfort and reduced risk of leakage by distributing stress and allowing independent movement of adhesive zones, enhancing flexibility and attachment to the skin while maintaining a secure seal.

Implementation Method 1

The void volume acts as a buffer and leakage barrier, allowing for lateral flexibility and movement

Methodology Applied
Scientific EffectStress distribution:

Implementation Method 2

An adhesive wafer design featuring a backing layer with independent first and second adhesive zones separated by a void volume

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS8319003B2Adhesive wafer
Publication Date: 2012.11.27 COLOPLAST AS
  • US8319003B2 patent drawing
  • US8319003B2 patent drawing
  • US8319003B2 patent drawing

AI summary

An adhesive wafer for an ostomy faceplate or wound dressing comprising a backing layer, said backing layer having one surface facing the skin, said surface comprising a first and a second adhesive zone being separated from each others by a void volume, said void volume being defined by the backing layer, the first and the second adhesive zones and the skin surface and wherein the first and the second adhesive zones are capable of moving independently of each others with respect to the lateral plane of the backing layer.