Segmented Anode Plate Layout for Uniform Film Plating Current
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Solution Overview
Problem
The current anode plates for film plating machines have inconsistent current distribution, leading to uneven plating layers on the conductive substrate film, especially when the machine breadth specification is large, due to the anode plate being connected at both ends, resulting in higher current at the ends and lower current in the middle.
Innovation Solution
The anode plate is designed by splicing multiple anode plate splicing units separated by an insulating medium, with each unit connected to the power supply, allowing for parallel connections and flexible adjustment of length to match the machine breadth, ensuring consistent current distribution and uniform plating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the anode plate length is increased to match larger machine breadth specifications, then the anode plate can cover the required area, but the current distribution becomes uneven with higher current at the ends and lower current in the middle
Solution Approach 1:
The anode plate is divided into multiple independent anode plate splicing units (first anode plate splicing unit, second anode plate splicing unit, etc.) that can be separately connected to the power supply. Each unit acts as an independent electrode, allowing separate current control and eliminating the current distribution unevenness that occurs in long integral anode plates where ends receive higher current than the middle.
2Ease of manufacture
If the anode plate is made as an integral structure, then the structure is simple and easy to manufacture, but the current distribution is uneven leading to poor plating consistency
Solution Approach 1:
Instead of manufacturing one large integral anode plate that is difficult to control for uniform current distribution, the invention segments it into multiple smaller splicing units. Each unit can be manufactured independently with consistent properties, and when assembled with insulating media between them, they function as separate electrodes connected in parallel to the power supply, ensuring uniform current distribution and plating consistency.
Solution Approach 2:
Insulating media are introduced between adjacent anode plate splicing units to prevent electrical shorting while allowing mechanical assembly. This intermediary element enables the construction of multi-unit anode plates that maintain electrical independence of each unit while forming a complete coverage structure, solving both the manufacturing simplicity and plating consistency requirements.
3Manufacturing precision
If multiple anode plate splicing units are used to improve current distribution uniformity, then plating layer consistency improves, but the device structure becomes more complex
Solution Approach 1:
The anode plate is segmented into multiple splicing units that are connected in parallel to the power supply. Each unit is an independent electrode with its own current path, ensuring uniform current distribution and plating layer consistency. The segmentation allows standardization of unit dimensions and simplifies the overall system by making each unit interchangeable and independently controllable.
Solution Approach 2:
The insulating media serve multiple functions: they provide electrical insulation between adjacent anode plate splicing units to prevent shorting, they facilitate the mechanical assembly and disassembly of the splicing units, and they maintain the structural integrity of the overall anode plate assembly. This multi-functionality reduces the need for additional complex components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a flexible and uniform plating layer on the conductive substrate film by adjusting the anode plate length and ensuring consistent current distribution, improving the plating layer's uniformity and consistency.
Implementation Method 1
The current collector is generally fabricated by forming a thick metal plating layer on a conductive substrate film in manner of electroplating
Implementation Method 2
each anode plate splicing unit is configured to be connected with the power supply, so that a parallel connection can be formed between the plurality of the anode plate splicing units, which causes the currents brought by the power supply into each anode plate splicing unit to be similar in magnitude
Data Source
AI summary
An anode plate for a film plating machine and a film plating machine are provided. The anode plate is formed by splicing a plurality of anode plate splicing units, and two adjacent anode plate splicing units are separated by an insulating medium. Each anode plate splicing unit is connected with a power supply. The anode plate is applicable to film plating machines of different breadth.