Segmented Back Frame for Flat Panel Displays
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Solution Overview
Problem
Conventional back frames for liquid crystal display devices are costly due to high material and mold expenses, and they lack effective heat dissipation and secure circuit board fixation.
Innovation Solution
A back frame design comprising primary and secondary assembling pieces with different thermally conductive materials and a bracing piece for adjustable mounting, which simplifies the mold structure, reduces material usage, and enhances heat dissipation and circuit board fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a unitary back frame is made with metal stamping or plastic injection molding, then the back frame structure is simple and integrated, but the material cost is high and the mold cost is high
Solution Approach 1:
The back frame is divided into multiple separate assembling pieces (first back frame piece, second back frame piece, third back frame piece, etc.) that are joined together through joining sections. This segmentation allows each piece to be manufactured separately with smaller, less expensive molds and reduces material waste compared to a single unitary structure.
2Area of stationary object
If a large-sized back frame is used, then the back frame can accommodate larger display panels, but large-sized stamping equipment is required and the mold size and structure become large and complicated
Solution Approach 1:
The large back frame is segmented into multiple smaller pieces that can be manufactured with smaller, simpler molds. These pieces are then assembled together to form the complete large-sized back frame, avoiding the need for large and complicated single-piece molds.
Solution Approach 2:
Multiple smaller back frame pieces are joined together through joining sections to form the complete large-sized back frame structure, achieving the functionality of a large frame while using smaller, simpler manufacturing components.
3Device complexity
If a unitary back frame is used, then the structure is integrated, but heat dissipation is insufficient and circuit board fixing is not secure
Solution Approach 1:
The back frame is segmented into multiple pieces with joining sections that create interfaces for heat transfer. These interfaces and the distributed structure improve heat dissipation compared to a unitary structure, while still maintaining overall structural integration.
Solution Approach 2:
The joining sections serve multiple functions: they mechanically connect the back frame pieces together, provide pathways for heat dissipation, and offer mounting points for circuit boards and other components, replacing the need for separate fixing structures.
4Adaptability or versatility
If different sizes of back frames are required for different display panel sizes, then each size requires a separate mold, but the mold expenditure becomes high
Solution Approach 1:
The back frame is designed as a modular system of standardized pieces that can be assembled in different configurations. This allows the same set of mold-produced pieces to create multiple back frame sizes by varying the assembly configuration, eliminating the need for separate molds for each size.
Solution Approach 2:
The joining sections and assembling pieces are designed with universal compatibility, allowing the same components to be used across different back frame sizes. This modular universality enables flexible size adaptation without requiring new molds for each product size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing costs, improves heat dissipation, and securely fixes the circuit board, addressing the limitations of conventional back frames.
Implementation Method 1
the first resilient bent section being located between the first bearing section and the bracing body and being bent from the first suspension section in a lengthwise direction of the first suspension section, the first bearing section and the first resilient bent section resiliently clamping a first side edge of the circuit board
Implementation Method 2
the at least two primary assembling pieces comprise a primary assembling piece that has a heat source arranged thereon, the primary assembling piece that has the heat source arranged thereon having a first heat transfer capability, the remaining one or more primary assembling pieces of the at least two primary assembling pieces that have no heat source arranged thereon having a second heat transfer capability, the first heat transfer capability being greater than the second heat transfer capability
Data Source
AI summary
The present invention provides a back frame of flat panel display device and a backlight system. The back frame includes primary assembling pieces, secondary assembling pieces, and a bracing piece for fixing a circuit board. The primary assembling pieces are connected through joining and use different thermally conductive materials. Further, a circuit board is mountable and position adjustable through a bracing piece. The present invention also provides a backlight system. The back frame and the backlight system of the present invention have a back frame of simple structure, reduce the expenditure of a back frame mold, facilitate heat dissipation, facility fixing of circuit board, and save the material used for back frame so as to lower down the manufacturing cost of flat panel display device.