Segmented Back Frame Heat Dissipation and Circuit Board Fixation
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Solution Overview
Problem
Conventional liquid crystal display devices have high material and mold costs due to complex back frame structures, which also hinder heat dissipation and circuit board fixation.
Innovation Solution
A back frame design comprising primary and secondary assembling pieces with reinforcement structures and a bracing piece for heat transfer and circuit board fixation, using different thermally conductive materials to simplify the mold structure and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a unitary back frame is made with metal stamping or plastic injection molding, then the structural strength is sufficient, but the material cost and mold cost are high
Solution Approach 1:
The back frame is divided into multiple separate assembling pieces (first back frame assembling piece, second back frame assembling piece, third back frame assembling piece, etc.) that are joined together through joining sections. This segmentation allows each piece to be manufactured separately using simpler, smaller molds, reducing both mold cost and material consumption while maintaining the overall structural strength through proper joining design with reinforcement structures.
2Strength
If a large-sized unitary back frame is used, then the structural integrity is maintained, but the heat dissipation capability is poor
Solution Approach 1:
The back frame is segmented into multiple pieces with joining sections that create gaps or interfaces between components. These interfaces serve as thermal pathways that improve heat dissipation capability while the reinforcement structures at the joining sections maintain the structural integrity and strength of the overall back frame assembly.
Solution Approach 2:
Different regions of the back frame assembly have different thermal conductivities. The joining sections and reinforcement structures are designed with specific thermal properties to optimize heat dissipation paths, allowing heat to be efficiently conducted away from critical areas while maintaining structural strength in load-bearing regions.
3Device complexity
If a unitary back frame is used, then the structure is simple, but the circuit board fixation is insufficient
Solution Approach 1:
The back frame is divided into multiple assembling pieces with joining sections that provide multiple attachment points and fixation locations. The third back frame assembling piece specifically includes a bracing piece with bearing sections and resilient bent sections that provide reliable circuit board fixation. This segmented design achieves reliable fixation without requiring a complex unitary structure.
4Temperature
If different thermally conductive materials are used for primary assembling pieces, then the heat dissipation is improved, but the manufacturing complexity increases
Solution Approach 1:
Different primary assembling pieces are made from materials with different thermal conductivities according to their specific functional requirements. Pieces that require superior heat dissipation use materials with higher thermal conductivity, while other pieces use materials optimized for their specific functions. This localized material selection improves overall heat dissipation performance while keeping the manufacturing process manageable through standardized joining methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces material and mold costs, enhances heat dissipation, and improves circuit board fixation while maintaining desired strength, thereby lowering the overall manufacturing cost of flat panel display devices.
Implementation Method 1
the primary assembling piece that has the heat source arranged thereon having a first heat transfer capability, the remaining one or more primary assembling pieces of the at least two primary assembling pieces that have no heat source arranged thereon having a second heat transfer capability
Implementation Method 2
the first resilient bent section being located between the first bearing section and the bracing body and being bent from the first suspension section in a lengthwise direction of the first suspension section, the first bearing section and the first resilient bent section resiliently clamping a first side edge of the circuit board
Data Source
AI summary
The present invention provides a flat panel display device, which includes a backlight system and a display panel. The backlight system includes a light source, a light homogenization mechanism, and a back frame. The back frame carries the light source and the light homogenization mechanism, and the light homogenization mechanism guides light from the light source into the display panel. The back frame includes primary assembling pieces, secondary assembling pieces, and a bracing piece for fixing a circuit board. The at least two primary assembling pieces are connected through joining and the two primary assembling pieces use different thermally conductive materials. Further, the primary assembling piece includes a joint section that forms a reinforcement structure and a circuit board is mountable and position adjustable through a bracing piece. The present invention also provides a stereoscopic display device and a plasma display device. The back frame and the backlight system of the present invention have a back frame of simple structure, reduce the expenditure of a back frame mold, facilitate heat dissipation, allow strength of the back frame to meet a desired requirement, improve fixing of circuit board, and save the material used for back frame so as to lower down the manufacturing cost of flat panel display device.