Segmented Backlight Frame Reducing Mold Complexity
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Solution Overview
Problem
Conventional backlight systems for liquid crystal display devices have high material and mold costs due to the use of unitary back frames made with metal stamping or plastic injection molding, which require large and complex equipment.
Innovation Solution
A backlight system comprising an LED light source with a stacked substrate structure and a back frame formed from multiple assembling pieces, where the back frame is constructed using at least two primary assembling pieces joined to form a main frame structure, reducing the complexity and size of the mold required, and a PCB is mounted on the second conductor wiring layer to minimize bracing and bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a unitary back frame is used for large-sized liquid crystal panels, then the structural integrity is improved, but the mold cost and material cost increase significantly
Solution Approach 1:
The back frame is divided into multiple separate pieces (first back frame piece, second back frame piece, third back frame piece) that are assembled together using connection structures. This segmentation allows each piece to be manufactured with smaller, simpler molds, reducing mold costs while maintaining the overall structural integrity through the connection mechanisms between pieces.
2Stability of the object's composition
If a unitary back frame is used, then the structural stability is improved, but the material consumption and manufacturing complexity increase
Solution Approach 1:
The back frame is segmented into multiple pieces that are joined together, allowing for optimized material usage in each component. This approach reduces overall material consumption compared to a single large-unitary frame while maintaining structural stability through the connection designs that ensure rigid assembly.
3Strength
If a unitary back frame is manufactured with large stamping equipment, then the frame strength is improved, but the equipment size requirement and manufacturing complexity increase
Solution Approach 1:
By dividing the back frame into multiple smaller pieces, each piece can be manufactured using standard-sized stamping equipment, eliminating the need for large, complex manufacturing equipment. The connection structures between pieces ensure that the assembled frame achieves the required strength without requiring oversized manufacturing tools.
4Reliability
If the PCB is mounted with traditional bracing and bumps, then the mounting reliability is improved, but the manufacturing cost and assembly complexity increase
Solution Approach 1:
The PCB mounting structure is merged with the LED substrate structure, where the PCB is directly disposed on the second conductor wiring layer of the LED substrate. This integration eliminates the need for separate bracing and bumps, reducing manufacturing cost and assembly complexity while maintaining mounting reliability through the integrated design.
Data Source
AI summary
The present invention provides a backlight system, which includes an LED light source, a back frame, and a PCB. The LED light source comprises an LED lamp and an LED substrate. The LED substrate includes, sequentially stacked, a first conductor wiring layer, a first insulation layer, an aluminum substrate, a second insulation layer, and a second conductor wiring layer and the LED lamp is mounted on the first conductor wiring layer. The back frame carries the LED light source and includes at least two primary assembling pieces. The at least two primary assembling pieces are joined to form a main frame structure of the back frame. The PCB is disposed on the second conductor wiring layer of the LED substrate. The backlight system of the present invention can reduce the cost of back frame mold and save the material and space of the back frame, so as to lower down the cost of the backlight system.