Segmented Backplane Design for High-Speed Signal Transmission

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Solution Overview

Problem

Current backplanes in network communication products are large and thick, making them difficult to manufacture and costly.

Innovation Solution

A backplane apparatus is designed with multiple smaller, independent backplane structures that can be assembled in various configurations to reduce size and thickness, including a primary backplane for power and low-speed signals and secondary backplanes for high-speed or optical signals, allowing for easier assembly and maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a single large backplane is used to provide power and signal interworking, then the backplane can support all functions (power transmission, low-speed signals, high-speed signals, optical signals), but the backplane becomes large in size and thickness, making it difficult to manufacture and costly

Engineering Contradiction:
Improvefunctional integrationVSAvoidmanufacturing difficulty
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent divides the traditional single large backplane into multiple independent backplane structures (first backplane for power and low-speed signals, second backplane for high-speed and optical signals). Each backplane can be manufactured separately with smaller size and thinner profile, reducing manufacturing difficulty and cost while maintaining all required functions through their coordinated arrangement.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If a single large backplane is used to provide power and signal interworking, then the backplane can support all functions, but the backplane becomes large in size and thickness, increasing cost

Engineering Contradiction:
Improvefunctional integrationVSAvoidcost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent divides the traditional single large backplane into multiple independent backplane structures (first backplane for power and low-speed signals, second backplane for high-speed and optical signals). Each backplane can be manufactured separately with smaller size and thinner profile, reducing manufacturing difficulty and cost while maintaining all required functions through their coordinated arrangement.

Inventive Principle:
Principle #1Segmentation

3Adaptability or versatility

If a single large backplane is used, then all signal types can be transmitted, but the backplane structure becomes complex and maintenance becomes difficult

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoidmaintenance performance
Core Design Contradiction:
Adaptability or versatilityVSEase of repair

Solution Approach 1:

The patent divides the backplane system into functionally independent modules (first backplane for power and low-speed signals, second backplane for high-speed and optical signals). This segmentation allows maintenance personnel to access, diagnose, and repair specific backplane modules independently without disassembling the entire system, significantly improving maintenance performance while preserving all signal transmission capabilities.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent extracts high-speed and optical signal transmission functions into a separate second backplane structure, isolating it from the first backplane that handles power and low-speed signals. This extraction enables independent maintenance of each functional module, reducing the complexity of troubleshooting and repair operations.

Inventive Principle:
Principle #2Taking out (Extraction)

4Adaptability or versatility

If a single large backplane is used, then comprehensive support is provided, but the overall structure becomes complex

Engineering Contradiction:
Improvecomprehensive supportVSAvoidstructural complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments the monolithic backplane structure into multiple smaller backplane structures with distinct functional responsibilities. The first backplane handles power and low-speed signals, while the second backplane handles high-speed and optical signals. This segmentation reduces the complexity of each individual structure, making them easier to design, manufacture, and assemble, while the collective system maintains comprehensive support for all signal types.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP2770682B1Back panel device and communication apparatus
Publication Date: 2016.01.20 HUAWEI TECH CO LTD
  • EP2770682B1 patent drawingFigure 1
  • EP2770682B1 patent drawingFigure 2
  • EP2770682B1 patent drawingFigure 3

AI summary

The present invention discloses a backplane apparatus, including a first backplane structure and a second backplane structure, where the first backplane structure is configured to transmit power and low-speed signals, and the second backplane structure is configured to transmit high-speed signals, low-speed signals, or optical signals. The first backplane structure includes a first backplane, multiple first connectors, and a connected space, where the first connectors are arranged on the first backplane and boards are electrically connected to the first backplane. The second backplane structure includes multiple second backplanes and multiple second connectors, where the second connectors are arranged on the second backplanes, the second backplanes are installed on the first backplane, and the second connectors are electrically connected to boards by crossing the connected space or via the first connectors. The present invention also discloses a communication device. By using the backplane apparatus and communication device provided in the present invention, a big backplane in the prior art is split into a relatively big first backplane and multiple relatively small second backplanes, thereby decreasing a size and thickness of the backplane, and reducing manufacturing difficulty and a cost of the backplane.