Segmented Backside Power Rails for Multi-Voltage Memory Layout
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Solution Overview
Problem
Conventional memory designs suffer from inefficiencies due to the use of frontside power rails for memory cells, resulting in an area penalty during fabrication, which necessitates an improvement in memory architecture to enhance area efficiency.
Innovation Solution
The implementation of a power distribution network with buried power supply rails in the physical layout design, utilizing buried backside metal for efficient backside power distribution, and incorporating power-gating schemes to reduce leakage and maximize transistor size within the same area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If frontside power rails are used for memory cells, then voltage distribution to memory cells is achieved, but area efficiency deteriorates due to area penalty in fabrication
Solution Approach 1:
The patent inverts the conventional power distribution approach by moving power rails from the frontside to the backside of the substrate. Buried power rails are formed in the backside of the substrate, and power is delivered to memory cells through via connections that penetrate the substrate thickness, thereby eliminating the area penalty associated with frontside power rails while maintaining voltage distribution functionality
Solution Approach 2:
The patent transitions power distribution from a two-dimensional frontside layout to a three-dimensional structure by utilizing the backside of the substrate and creating vertical via connections through the substrate thickness. This dimensional change allows power rails to be positioned in the backside rather than occupying horizontal space on the frontside, improving area efficiency
2Area of stationary object
If buried power rails are implemented, then area efficiency is improved, but power distribution complexity increases
Solution Approach 1:
The patent segments the power distribution network into distinct functional components: backside power rails for voltage distribution, via connections for vertical power delivery, and integration with frontside memory cell structures. This segmentation allows each component to be optimized independently and simplifies the overall implementation of the buried power rail architecture
Solution Approach 2:
The buried power rails on the backside serve multiple functions: they provide voltage distribution to memory cells, reduce area occupancy compared to frontside rails, and can be integrated with existing substrate structures. The via connections also serve dual purposes by providing both mechanical support and electrical connectivity
Data Source
AI summary
Various implementations described herein are related to a device having logic that operates in multiple voltage domains. The device may include a backside power network with rows of segmented supply rails coupled to the logic. The rows of segmented supply rails may include alternating rail breaks that define an interchanging directional supply of power to the logic in the multiple voltage domains.