Segmented Baseplate Cooling for Power Electronics

Solution Overview

Problem

Power electronic systems face challenges in thermal management and mechanical durability due to cyclic temperature changes, which stress component connections with different thermal expansion coefficients, leading to reduced durability and thermal loading capacity.

Innovation Solution

A power electronic system with a baseplate acting as a cooling device, connected to a secondary cooling device, utilizing ceramic insulating material bodies with conductor tracks and an internal connecting device formed from alternating conductive and insulating films to enhance thermal coupling and mechanical decoupling, thereby improving durability and thermal efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a baseplate is used to thermally connect power semiconductor components to a cooling device, then thermal efficiency is improved, but mechanical durability deteriorates due to cyclic temperature changes and different thermal expansion coefficients

Engineering Contradiction:

Improvethermal efficiencyVSAvoidmechanical durability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The baseplate is divided into multiple separate baseplate sections that are arranged in a grid pattern with spacing between them. This segmentation allows each section to independently expand and contract with temperature changes, reducing mechanical stress on connections while maintaining thermal contact with the cooling device.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The baseplate sections are given a preliminary bend (pre-formed curvature) before assembly. This pre-stressing compensates for thermal expansion during operation, allowing the sections to accommodate temperature fluctuations without creating excessive mechanical loads on the power semiconductor components and connections.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If the baseplate is segmented to improve mechanical durability, then reliability is improved, but thermal coupling deteriorates

Engineering Contradiction:

Improvemechanical durabilityVSAvoidthermal coupling

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The baseplate is divided into multiple separate baseplate sections that are arranged in a grid pattern with spacing between them. This segmentation allows each section to independently expand and contract with temperature changes, reducing mechanical stress on connections while maintaining thermal contact with the cooling device.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The baseplate sections are given a preliminary bend (pre-formed curvature) before assembly. This pre-stressing compensates for thermal expansion during operation, allowing the sections to accommodate temperature fluctuations without creating excessive mechanical loads on the power semiconductor components and connections.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves improved thermal coupling and mechanical durability by reducing mechanical loading on component connections while maintaining optimal thermal efficiency, enhancing the overall performance and lifespan of power electronic systems.

Implementation Method 1

heat resulting from power loss in the power semiconductor components must be dissipated from the system to or via the cooling device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a plurality of first insulating material bodies (160) which are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their respective first main surface on the cooling device. These insulating material bodies, which are preferably formed of a ceramic material, electrically insulate power switches of the power electronic system from the cooling device

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 3

each having exactly one first conductor track (162), which is arranged on a second main surface of the first insulating material body (160) and is cohesively connected thereto

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9159639B2Power electronic system with a cooling device

Publication Date: 2015.10.13 SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG

AI summary

A power electronic system with a cooling device, and a method for producing the system, comprising a plurality of submodules, each submodule having a first planar insulating material body, one first conductor track cohesively connected thereto, one power switch arranged on the conductor track, at least one internal connecting device composed of an alternate layer sequence of at least one electrically conductive film and at least one electrically insulating film, wherein at least one electrically conductive layer forms at least one second conductor track, and comprising external connection elements. In this case, the submodules are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their first main surface on the cooling device. At least one second conductor track at least partially covers first conductor tracks of two submodules, electrically connects them to one another and covers an interspace between the submodules.