Segmented Beam Manipulator Electrodes for Homogeneous Field Control
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Solution Overview
Problem
Existing manipulator devices for charged particle systems, such as multi-beam lithography systems, face challenges in producing a homogeneous electric field, leading to inaccurate beam manipulation and a low fill factor, which complicates the arrangement of control circuitry and increases cross-talk between components.
Innovation Solution
A manipulator device with a planar substrate featuring through openings with sets of electrodes arranged along the perimeter, where each set of electrodes is equipped with resistors forming a voltage divider to optimize the electric field homogeneity by adjusting voltages based on the angular position of the electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional manipulator devices with electrodes are used to manipulate charged particle beams, then beam manipulation is achieved, but the electric field is not homogeneous leading to manipulation inaccuracies
Solution Approach 1:
The patent applies local quality by making different parts of the electrode structure have different properties. Specifically, the electrode is divided into multiple segments along the perimeter of the through-opening, with each segment capable of receiving different voltages. This allows the electric field to be optimized locally at different positions to achieve overall homogeneity, resolving the contradiction between manipulation accuracy and field homogeneity.
Solution Approach 2:
The patent implements dynamics by making the electrode system adjustable and configurable. The electrode segments can dynamically receive different voltage levels based on the required manipulation precision, allowing the electric field distribution to be optimized in real-time. This dynamic control enables homogeneous electric field generation while maintaining high beam manipulation accuracy.
2Productivity
If closely spaced arrays of manipulators are used to manipulate closely spaced charged particle beamlets, then individual beam manipulation is achieved, but the arrangement of control circuits becomes difficult and cross-talk increases
Solution Approach 1:
The patent applies merging by combining multiple electrode segments into a single planar substrate structure. Instead of requiring separate manipulator devices for each beamlet, multiple electrode segments on the same substrate can collectively manipulate multiple beamlets. This integration reduces the overall number of discrete components and simplifies control circuit arrangement, resolving the contradiction between high productivity and device complexity.
Solution Approach 2:
The patent implements universality by designing the planar substrate with multiple electrode segments that can serve multiple functions. The same substrate and electrode structure can manipulate multiple beamlets simultaneously, making the device multi-functional. This approach eliminates the need for separate dedicated manipulators for each beamlet, reducing control circuit complexity while maintaining high beamlet throughput.
3Measurement precision
If through openings are made smaller to increase fill factor, then manipulation precision improves, but the arrangement of control circuitry becomes more difficult
Solution Approach 1:
The patent applies dimensionality change by transitioning from a three-dimensional array of separate manipulator devices to a two-dimensional planar substrate with integrated electrode segments. This dimensional reduction allows smaller through-openings for precision manipulation while providing sufficient space on the planar surface for control circuitry arrangement, resolving the contradiction between manipulation precision and ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a more accurate and precise manipulation of charged particle beams with a higher fill factor, allowing for more compact and efficient design of charged particle systems by reducing the size of through openings and enabling closer arrangement of control circuitry.
Implementation Method 1
Charge particle beams can be manipulated (or deflected) by applying an electric field over a through opening, through which the beams pass. The characteristics of the electric field (e.g. strength and form) define, at least partly, the manipulation or deflection of the beam(s).
Implementation Method 2
Charge particle beams can be manipulated (or deflected) by applying an electric field over a through opening
Implementation Method 3
each set of electrodes is provided with pluralities of resistors, each plurality of resistors being arranged as a voltage divider and provided in the planar substrate, wherein the resistances of each plurality of resistors are for providing voltages to the corresponding set of electrodes
Data Source
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Figure 3A
AI summary
The invention relates to a charged particle system such as a multi beam lithography system, comprising a manipulator device for manipulation of one or more charged particle beams, wherein the manipulator device comprises at least one through opening in the plane of the planar substrate for passing at least one charged particle beam there through. Each through opening is provided with electrodes arranged in a first set of multiple first electrodes along a first part of a perimeter of said through opening and in a second set of multiple second electrodes along a second part of said perimeter. An electronic control circuit is arranged for providing voltage differences the electrodes in dependence of a position of the first and second electrode along the perimeter of the through opening.