Segmented Bonding Layer Warpage Control in Semiconductor Camera Packages
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Solution Overview
Problem
In semiconductor packaging, controlling warpage of semiconductor substrates is challenging, especially when the supporting substrate is larger than the semiconductor substrate, leading to issues like deformation of micro lenses and reduced image quality due to high linear expansion coefficients of bonding resins.
Innovation Solution
A semiconductor apparatus is designed with a bonding layer comprising two resin members with different linear expansion coefficients, where one resin member is placed inside the outer edge of the semiconductor substrate and the other between the outer edge and the first resin member, allowing for controlled warpage and deformation of the semiconductor substrate without enlarging the chip size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding layer with high linear expansion coefficient resin is used to bond the semiconductor substrate and supporting substrate, then bonding strength is improved, but warpage and deformation of the semiconductor substrate increases
Solution Approach 1:
The bonding layer is segmented into multiple regions with different resin materials having different linear expansion coefficients. The first region (central) uses high expansion coefficient resin for strong bonding, while the second region (peripheral) uses low expansion coefficient resin to suppress warpage, achieving both strong bonding and flat substrate shape.
Solution Approach 2:
Different regions of the bonding layer are assigned different material properties (linear expansion coefficients) according to their functional requirements. The central region requires high bonding strength while the peripheral region requires warpage control, and this local differentiation of material quality resolves the contradiction.
2Area of stationary object
If the supporting substrate is made larger than the semiconductor substrate, then bonding area is increased, but warpage control becomes more difficult
Solution Approach 1:
The bonding layer is divided into different regions with different resin materials. The peripheral region uses low expansion coefficient resin to counteract the warpage tendency caused by the larger supporting substrate area, enabling both increased bonding area and warpage control.
3Volume of moving object
If the semiconductor substrate is miniaturized to CSP size, then device size is reduced, but warpage control becomes more challenging
Solution Approach 1:
Even in miniaturized CSP packages, the bonding layer is segmented into central and peripheral regions with different resin materials. This segmentation enables effective warpage control in small devices by balancing the bonding strength and dimensional stability across different areas.
4Ease of manufacture
If uniform resin material is used in the bonding layer, then manufacturing process is simplified, but warpage cannot be controlled
Solution Approach 1:
The bonding layer is segmented into different regions with different resin materials to control warpage. While this increases material complexity, the segmentation can be achieved through standard semiconductor manufacturing processes, balancing warpage control capability with manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses warpage and deformation of the semiconductor substrate, improving image quality by reducing the impact on micro lenses and enabling miniaturization of the semiconductor apparatus while maintaining bonding strength.
Implementation Method 1
a linear expansion coefficient of the first resin member is less than a linear expansion coefficient of the second resin member
Data Source
AI summary
A semiconductor apparatus in which are bonded a semiconductor substrate, in which a semiconductor element is arranged, and a supporting substrate is provided. A bonding layer for bonding the semiconductor substrate and the supporting substrate is arranged between the supporting substrate and a front side of the semiconductor substrate on the side of the supporting substrate. The bonding layer includes a first resin member arranged in a first region inside of an outer edge of the semiconductor substrate in an orthographic projection to the front side, and a second resin member arranged in a second region between the outer edge of the semiconductor substrate and the first region, in the orthographic projection to the front side. A linear expansion coefficient of the first resin member is less than a linear expansion coefficient of the second resin member.