Segmented Bonding Pad for Transparent Display Substrate
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Solution Overview
Problem
Current transparent displays face limitations in enhancing transparency while maintaining display quality, as conventional bonding pads consume considerable space on the substrate, affecting light transmittance.
Innovation Solution
The design incorporates a display substrate with a first bonding pad comprising a main bonding portion and an auxiliary bonding portion, featuring gaps between them, allowing for electrical connection while minimizing substrate coverage and maximizing light passage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding pads are used to ensure electrical connection, then reliability of electrical connection is improved, but transmittance of the display panel deteriorates due to increased substrate coverage
Solution Approach 1:
The bonding pad is divided into a main bonding portion and multiple auxiliary bonding portions separated by gaps. This segmentation reduces the continuous coverage area on the substrate while maintaining electrical connection functionality through multiple discrete contact points, thereby improving light transmittance without sacrificing connection reliability.
Solution Approach 2:
Different portions of the bonding pad structure serve different functions: the main bonding portion provides primary electrical connection within the bonding district, while auxiliary bonding portions provide additional connection points outside the bonding district. This local differentiation allows optimized light transmission through strategic placement of conductive materials only where needed for electrical function.
2Manufacturing precision
If bonding pad area is increased to provide tolerance for process errors, then manufacturing precision is improved, but transmittance deteriorates due to larger obstacles to light transmission
Solution Approach 1:
Multiple auxiliary bonding portions are distributed around the main bonding portion, creating a segmented structure that provides process error tolerance through redundant connection points without requiring a large continuous area. The gaps between segments allow light transmission while the distributed arrangement ensures at least one auxiliary portion remains within bonding tolerance range.
Solution Approach 2:
The auxiliary bonding portions are positioned in different spatial locations (inside and outside the bonding district) to provide tolerance for positional variations in the light emitting component. This multi-dimensional distribution achieves process robustness without increasing the overall footprint or continuous coverage area that would block light.
3Ease of manufacture
If continuous bonding pad structure is used to ensure electrical connection, then ease of manufacture is improved, but transmittance deteriorates due to lack of gaps for light passage
Solution Approach 1:
The bonding pad is segmented into discrete portions (main bonding portion and auxiliary bonding portions) connected through conductive materials. While this requires additional patterning steps compared to a continuous structure, the segmentation enables light passage through gaps and maintains electrical connectivity, achieving a balance between manufacturability and optical performance.
Solution Approach 2:
The bonding pad structure serves multiple functions: the main bonding portion provides primary electrical connection, auxiliary bonding portions provide redundant connections and process tolerance, and the gaps between portions enable light transmission. This multi-functionality is achieved within a single fabrication process sequence, maintaining ease of manufacture while improving transmittance.
Data Source
AI summary
A display substrate comprises a base board and a first bonding pad. The base board comprises a first surface having a first bonding district. The first bonding pad is disposed on the first surface. The first bonding pad is configured to electrically connect to a first electrode of a light emitting component in the first bonding district. The first bonding pad comprises a main bonding portion and an auxiliary bonding portion, wherein at least a part of an orthogonal projection of the main bonding portion on the base board is in the first bonding district. The auxiliary bonding portion electrically connects to the main bonding portion, wherein at least a part of an orthogonal projection of the auxiliary bonding portion on the base board is outside the first bonding district. There is a gap between the main bonding portion and the auxiliary bonding portion.