Segmented Bonding Pads for Void-Resistant Semiconductor Stacking
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Solution Overview
Problem
Existing semiconductor storage devices face challenges in improving electrical characteristics due to voids formed between bonding pads during the bonding process, which increase electrical resistance and can lead to breaks caused by stress migration.
Innovation Solution
The semiconductor storage device incorporates a bonding pad configuration with multiple electrode portions separated in the X and Y directions, connected to a trace, and insulated by an insulator. This configuration reduces the likelihood of voids forming between bonding pads and distributes stress evenly, enhancing electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding pads are used in conventional semiconductor storage devices, then electrical connectivity is achieved, but voids form between bonding pads during bonding which increase electrical resistance and can lead to breaks
Solution Approach 1:
The bonding pad is divided into multiple electrode portions (first electrode portion and second electrode portion) that are separated in the planar direction. This segmentation allows each electrode portion to be bonded independently to the corresponding bonding pad on the other substrate, preventing void formation between bonding pads while maintaining electrical connectivity. The multiple electrode portions distribute the bonding pressure and reduce the likelihood of voids forming during the bonding process.
2Reliability
If bonding pads are used in conventional semiconductor storage devices, then electrical connectivity is achieved, but stress migration causes breaks in the bonding pads
Solution Approach 1:
The bonding pad is divided into multiple electrode portions that are separated in the planar direction. This segmentation distributes the stress from stress migration across multiple smaller electrode portions rather than concentrating it in a single large bonding pad. The insulator between the electrode portions further isolates stress, preventing crack propagation and breaks while maintaining overall electrical connectivity through the multiple parallel electrode portions.
3Reliability
If multiple electrode portions are used in bonding pads, then voids are reduced and stress distribution is improved, but device structure becomes more complex
Solution Approach 1:
An insulator is extracted and placed between the multiple electrode portions in the bonding pad. This insulator serves multiple functions: it electrically isolates the electrode portions, provides mechanical support, and simplifies the overall structure by preventing short circuits. The insulator's presence allows the multiple electrode portions to be implemented without significantly increasing device complexity, as the insulator is a standard component in semiconductor fabrication.
Data Source
AI summary
A semiconductor storage device includes a first substrate, a second substrate, a first stacked body, and a second stacked body. The first stacked body is provided between the first substrate and the second substrate and includes a first trace, a first pad connected to the first trace, and a first insulator. The second stacked body is provided between the first stacked body and the second substrate and includes a second trace, a second pad connected to the second trace, and a second insulator. The first pad includes a plurality of first electrode portions connected to the first trace. The first insulator is provided between the plurality of first electrode portions. The plurality of first electrode portions are bonded to the second pad.