Segmented Bonding Wire for Semiconductor Package RDL Adhesion
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Solution Overview
Problem
The existing semiconductor package manufacturing process requires a grinding step to expose interconnection components, which is costly and time-consuming, and can lead to delamination issues between the redistribution layer (RDL) and the interconnection component due to powder adherence and uneven surfaces.
Innovation Solution
A package device and manufacturing method that eliminates the grinding process by forming conductive segments with distinct surfaces above and below the encapsulant, allowing the RDL to be disposed on both surfaces for improved adhesion and reduced delamination, using a bonding wire separated into segments with varying surface roughness to enhance contact area and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a grinding process is used to expose the interconnection component from the encapsulant, then the upper surface of the interconnection component can be exposed for RDL connection, but the manufacturing cost increases and time consumption increases
Solution Approach 1:
The bonding wire is divided into two separate conductive segments (first conductive segment and second conductive segment) by removing the connecting segment. This segmentation allows each segment to be independently positioned and connected to the RDL without requiring grinding, thereby reducing manufacturing time while achieving proper exposure and connection.
Solution Approach 2:
The conductive segments are pre-formed with connecting segments that extend beyond the encapsulant surface before final assembly. This preliminary configuration allows the RDL to be directly connected to the exposed portions of the conductive segments without requiring subsequent grinding operations, thus eliminating time-consuming post-processing steps.
2Manufacturing precision
If a grinding process is used to expose the interconnection component, then the upper surface can be exposed, but manufacturing cost increases
Solution Approach 1:
By segmenting the bonding wire into separate conductive segments with exposed portions, the design eliminates the need for expensive grinding equipment and processes, thereby reducing manufacturing cost while still achieving the required exposure for RDL connection.
Solution Approach 2:
Instead of using the conventional approach of encapsulating the entire bonding wire and then grinding to expose the interconnection component, this invention inverts the approach by designing the bonding wire structure itself to have exposed conductive segments that protrude from the encapsulant, eliminating the need for grinding operations.
3Manufacturing precision
If grinding is used to expose the interconnection component, then the surface can be exposed, but delamination may occur between the RDL and interconnection component due to powder adherence and uneven surfaces
Solution Approach 1:
The invention inverts the conventional approach by having the conductive segments protrude from the encapsulant in a controlled manner without requiring grinding. This eliminates the generation of powder and uneven surfaces that cause delamination, thereby improving adhesion reliability between the RDL and conductive segments.
Solution Approach 2:
The connecting segment, which would normally be a waste material removed during grinding, is instead utilized as a design feature that provides the exposed portion for direct RDL connection. This converts what would be a harmful removal process into a beneficial structural feature that enhances adhesion by providing a clean, controlled exposure surface.
4Device complexity
If the bonding wire is used as a single continuous structure, then the connection is simple, but the contact area between RDL and conductive segment is limited
Solution Approach 1:
The bonding wire is segmented into multiple conductive segments with exposed portions that can be independently connected to the RDL. This segmentation increases the total contact area between the RDL and conductive segments, improving electrical connection reliability while maintaining relatively simple device structure.
Solution Approach 2:
The conductive segments are positioned in three-dimensional space with exposed portions extending beyond the encapsulant surface. This spatial arrangement creates multiple contact points and increases the effective contact area between the RDL and conductive segments, enhancing connection reliability without significantly increasing device complexity.
Data Source
AI summary
A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.