Segmented Brush Assembly for Uniform Wafer Cleaning Pressure

Solution Overview

Problem

Existing substrate cleaning apparatuses apply uneven contact pressure during the cleaning process, leading to potential wafer damage and deterioration due to concentrated brush pressure in the middle area, exacerbated by sagging of porous brushes.

Innovation Solution

A substrate cleaning apparatus with a segmented brush assembly and magnetic position adjustment system, allowing for individual control of brush segments to apply uniform contact pressure and adjust positions, ensuring even cleaning across the substrate surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If porous roll brushes are used to hold cleaning solution, then cleaning effectiveness is improved, but brush sagging occurs causing concentrated pressure on the middle area of the wafer

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidbrush pressure distribution

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The brush assembly is divided into multiple independent brush segments (first, second, third, and fourth segments) that can be individually adjusted. Each segment is connected to the core through connectors that allow independent position adjustment, enabling separate control of pressure applied to different areas of the wafer surface.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different brush segments are positioned at different distances from the wafer surface to create localized pressure variations. The adjustment mechanism allows each segment to be independently positioned, so that segments over the middle area can be adjusted to compensate for sagging and apply appropriate pressure, while segments over edge areas maintain their original positioning.

Inventive Principle:

Principle #3Local quality

2Productivity

If roll brushes rotate in place during cleaning, then cleaning process is efficient, but higher contact rate in the middle area causes wafer damage or deterioration

Engineering Contradiction:

Improvecleaning efficiencyVSAvoidwafer damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The brush segments are designed to be dynamically adjustable during operation. The position of each brush segment can be modified to change the contact pressure distribution, allowing the system to adapt and prevent excessive pressure concentration that could damage the wafer while maintaining cleaning efficiency.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The brush segment positions can be pre-adjusted before the cleaning operation to establish an optimal pressure distribution pattern. This preliminary positioning prevents middle-area pressure concentration from occurring during the cleaning process, thereby preventing wafer damage before it happens.

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If uniform contact pressure is applied across the substrate, then cleaning uniformity is improved, but requires complex adjustment mechanism for each brush segment

Engineering Contradiction:

Improvecleaning uniformityVSAvoidadjustment mechanism complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The brush assembly is divided into multiple independent brush segments (first, second, third, and fourth segments) that can be individually adjusted. Each segment is connected to the core through connectors that allow independent position adjustment, enabling separate control of pressure applied to different areas of the wafer surface.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different brush segments are positioned at different distances from the wafer surface to create localized pressure variations. The adjustment mechanism allows each segment to be independently positioned, so that segments over the middle area can be adjusted to compensate for sagging and apply appropriate pressure, while segments over edge areas maintain their original positioning.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus enhances cleaning accuracy and efficiency by distributing contact pressure uniformly, reducing the risk of wafer damage and improving cleaning effectiveness.

Implementation Method 1

an adjustment frame spaced apart from an outer circumferential surface of the brush, the adjustment frame being configured to generate magnetic force to move at least one of the plurality of segments in a direction intersecting with the rotation axis

Methodology Applied

Scientific EffectMagnetic force: Magnetism

Implementation Method 2

a connector of the one or more connectors that is connected to the at least one segment is configured to change shape with movement of the at least one segment

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS20250329552A1Substrate cleaning apparatus

Publication Date: 2025.10.23 SAMSUNG ELECTRONICS CO LTD

AI summary

A substrate cleaning apparatus includes a core including a plurality of segments having magnetism and one or more connectors connecting the plurality of segments to each other, the core being configured to rotate about a rotation axis; a brush surrounding at least a portion of the core and configured to rotate together with the core; and an adjustment frame spaced apart from an outer circumferential surface of the brush, the adjustment frame being configured to generate magnetic force to move at least one of the plurality of segments in a direction intersecting with the rotation axis.