Segmented Carrier Strain Gauge for Adhesive-Free Measurement
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Solution Overview
Problem
Existing strain measurement technologies face challenges such as low sensitivity, large size, poor spatial resolution, and distortion due to adhesive influence, especially in measuring multi-axial stresses and temperature compensation.
Innovation Solution
A strain-measuring structure with a structured carrier divided into regions by predetermined breaking points, allowing for independent movement and minimally invasive attachment to the object, featuring measuring assemblies that can be based on various principles like resistive, capacitive, or optical measurements, and utilizing semiconductor MEMS spring structures for enhanced sensitivity and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor strain gauges are rigidly glued over the entire surface to increase stability, then the stability of the strain gauge is improved, but the mechanical properties of the adhesive influence and distort the strain measurement
Solution Approach 1:
The carrier is divided into multiple regions separated by predetermined breaking points, allowing the strain-measuring structure to be segmented into independent regions that can move freely relative to each other during strain measurement, eliminating adhesive distortion while maintaining stability through the structured carrier design
Solution Approach 2:
The adhesive is completely removed from the strain measurement interface. The regions are joined to the object without adhesive, allowing the measuring assemblies to detect strain without mechanical interference from adhesive layers, thus eliminating the distortion problem while maintaining reliability through the rigid carrier structure
2Device complexity
If metallic strain gauges are used, then the assembly is simple, but the k-factors are low and the sensitivities are low resulting in large strain gauges and poor spatial resolution
Solution Approach 1:
The material parameter of the strain gauge is changed from metallic to semiconductor, which fundamentally changes the k-factor and sensitivity characteristics. Semiconductor materials provide much higher sensitivity and spatial resolution while the structured carrier design maintains assembly simplicity through standardized regions and breaking points
3Measurement precision
If the carrier is separated into regions before joining to the object, then the regions can move freely during strain measurement, but the handling and storage of the structure becomes difficult
Solution Approach 1:
The carrier is designed with predetermined breaking points that are prepared in advance but remain intact during handling and storage. The breaking points are configured to separate the carrier into regions only after joining to the object, allowing easy handling of the intact structure while ensuring free movement of regions during measurement
Solution Approach 2:
The structured carrier with breaking points provides a pre-configured structure that cushions against handling difficulties. The breaking points are designed to separate cleanly along predetermined lines, making the structure easy to handle in its intact state while enabling the desired region independence during measurement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a highly sensitive, compact, and robust strain measurement system with improved precision and reduced error, capable of measuring multi-axial strains without distorting the object's stress measurement, and offering excellent temperature compensation and dynamic range.
Implementation Method 1
the carrier has at least two regions which are separated from one another by a predetermined breaking point
Implementation Method 2
Strain gauges are based on the change in electrical resistance due to changes in length and cross-section
Implementation Method 3
utilizing semiconductor MEMS spring structures for enhanced sensitivity and precision
Data Source
AI summary
The invention relates to a strain-measuring structure, comprising a carrier, which is divided into regions along the predetermined breaking points only after being joined to the object to be measured. After the separation along the predetermined breaking points, the regions individually joined in the joining zones can be moved freely relative to one another in the event of strain of the object, without the strain-measuring structure applying significant forces to the object to be measured, which could distort the strain measurement. Measuring assemblies for measuring strain lie between the regions. Said measuring assemblies can be based on different principles, depending on the application. The invention further relates to a method for producing the strain-measuring structure, to a method for measuring the strain of objects, and to the use of the structure to measure strain. The invention further preferably relates to a system comprising the strain-measuring structure and a control device for reading out and preferably activating and joining the structure.