Segmented Carrier Layout for Circuit Substrate Thermal Stress Relief
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Solution Overview
Problem
Electronic devices face issues such as deformation, warpage, and uneven heat dissipation due to differing thermal expansion coefficients among components and film layers, affecting performance.
Innovation Solution
The electronic device design includes a circuit substrate with multiple carriers separated by gaps, where the width of the gaps and carriers are configured to satisfy the relationship Wa*2*10−4<Wg<(Wc−Wa*2), enhancing heat dissipation and reducing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If carriers are disposed closely on the circuit substrate to improve space utilization, then device integration is improved, but thermal stress and deformation increase due to differing thermal expansion coefficients
Solution Approach 1:
The patent divides the continuous carrier structure into multiple separate carriers with gaps between them. This segmentation allows each carrier to independently manage thermal expansion, reducing cumulative thermal stress and deformation while maintaining overall device stability. The gaps act as stress relief zones that prevent the propagation of thermal deformation across the entire carrier array.
2Area of stationary object
If carriers are disposed closely on the circuit substrate to improve space utilization, then device integration is improved, but heat dissipation performance deteriorates due to uneven heat distribution
Solution Approach 1:
By segmenting the carrier array into discrete units with gaps, the patent enables improved heat dissipation. The gaps facilitate air circulation and thermal management, allowing heat to dissipate more uniformly across the device. This prevents localized heat accumulation that would occur with continuous carrier coverage, thereby improving overall thermal performance.
3Stability of the object's composition
If gap width is increased to reduce thermal stress, then thermal stress is reduced, but space utilization deteriorates
Solution Approach 1:
The patent optimizes the gap width parameter within a specific range (0.01mm to 0.1mm) to achieve the best balance between thermal stress reduction and space utilization. This parameter optimization ensures that the gaps are sufficiently wide to provide stress relief and heat dissipation benefits, while remaining narrow enough to maintain high carrier density and effective use of the substrate area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat distribution evenness, reduces thermal stress, and mitigates deformation, leading to improved performance and reliability of electronic components.
Implementation Method 1
The bonding layer bonds the plurality of carriers to the circuit substrate
Implementation Method 2
deformation or warpage, for example, is likely to be generated in different components and/or film layers due to different thermal expansion coefficients
Implementation Method 3
when heat dissipation is adversely affected or heat distribution is uneven
Data Source
AI summary
An electronic device and a manufacturing method thereof are provided. The electronic device includes a circuit substrate, a plurality of electronic components, a plurality of carriers, and a bonding layer. The circuit substrate includes a circuit layer. The plurality of electronic components are disposed on the circuit substrate. The circuit layer is electrically connected to at least one of the plurality of electronic components. The plurality of carriers are disposed on the circuit substrate. The bonding layer bonds the plurality of carriers to the circuit substrate. At least one gap is between the plurality of carriers. A width of the gap is Wg. An average width of the plurality of carriers is Wa. A width of the circuit substrate is Wc. The electronic device satisfies: Wa*2*10−4<Wg<(Wc−Wa*2).