Segmented Carrier Wafer Processing for Dual-Side Semiconductor Access
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing semiconductor devices face challenges in balancing cost reduction and mechanical stability during processing, particularly when dealing with standard wafer sizes and thicknesses, which limits flexibility in meeting conflicting requirements for chip reliability.
Innovation Solution
A method involving processing a semiconductor body at opposite surfaces, attaching it to a carrier with an inner and outer part, and detaching the inner part of the carrier to enhance flexibility and accessibility during manufacturing and testing, allowing for reduced process complexity and improved mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wafers are processed at the front side and back side to meet chip reliability requirements, then mechanical stability is improved, but process complexity increases
Solution Approach 1:
The carrier is segmented into an inner part and an outer part that can be detached separately. The inner part is removed after front side processing to enable back side processing, while the outer part remains attached to provide mechanical support throughout the entire process, resolving the contradiction between reliability and process complexity
Solution Approach 2:
The semiconductor wafer is attached to the carrier before front side processing begins. This preliminary attachment provides mechanical stability during processing while allowing subsequent detachment of the inner part, enabling the wafer to be processed at both surfaces without compromising reliability or excessive complexity
2Ease of manufacture
If standard wafer sizes and thicknesses are used, then manufacturing cost is reduced, but manufacturing flexibility is limited
Solution Approach 1:
The carrier structure serves multiple functions: it provides mechanical support during processing, enables access to both front and back surfaces, and allows selective removal of the inner part. This multi-functionality enables processing of standard wafers with enhanced flexibility without significantly increasing manufacturing cost
3Stability of the object's composition
If the carrier is attached to the semiconductor body for mechanical stability, then processing stability is improved, but accessibility to the first surface is reduced
Solution Approach 1:
The carrier is divided into inner and outer parts with different functions. The inner part is detached after front side processing to restore accessibility to the first surface, while the outer part remains to maintain mechanical stability during back side processing, thus resolving the contradiction between stability and accessibility
Data Source
AI summary
A method of manufacturing a semiconductor device in a semiconductor body is proposed. The method includes processing a semiconductor body at a first surface of the semiconductor body. The method further includes attaching the semiconductor body to a carrier via the first surface. The carrier includes an inner part and an outer part at least partly surrounding the inner part. The method further includes processing the semiconductor body at a second surface opposite to the first surface. The method further includes detaching the inner part of the carrier from the semiconductor body.