Segmented Ceramic Substrates for LED Thermal Management
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Solution Overview
Problem
Conventional lighting devices with ceramic substrates face issues of reduced service life due to impaired thermal linking and high material costs, as well as fragility and space requirements for electrical insulation, leading to increased costs and complexity.
Innovation Solution
The use of small, interconnected substrate modules with conductor tracks and a reflector carrier for semiconductor light sources, which allows for improved thermal and electrical contact, reduced material usage, and enhanced durability, eliminating the need for large-area ceramic substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large-area ceramic substrate is used to arrange multiple semiconductor light sources, then electrical insulation from the heat sink is achieved, but thermal linking of the semiconductor light sources is impaired
Solution Approach 1:
The patent divides the substrate into multiple individual ceramic substrates, each carrying one or few semiconductor light sources. Each substrate is directly attached to the heat sink, ensuring optimal thermal coupling while maintaining electrical insulation through the ceramic material itself. This segmentation allows each LED to have its own thermal path to the heat sink without compromising electrical isolation.
2Reliability
If air clearances and creepage paths are increased to meet protection class requirements, then electrical insulation is improved, but device space increases
Solution Approach 1:
The ceramic substrate serves multiple functions simultaneously: it provides electrical insulation between the semiconductor light sources and the heat sink, acts as a mechanical carrier for the LEDs, and functions as a thermal management interface when directly attached to the heat sink. This multi-functionality eliminates the need for separate insulation structures, reducing overall device space while meeting protection class requirements.
3Device complexity
If a large-area ceramic substrate is used, then all semiconductor light sources can be arranged on one substrate, but the substrate is prone to breaking during production or use
Solution Approach 1:
The patent divides the substrate into multiple individual ceramic substrates, each carrying one or few semiconductor light sources. These smaller substrates are significantly more resistant to mechanical stress and less prone to breaking during production or use compared to a single large-area substrate. The segmented design maintains structural integrity while enabling flexible arrangement on the heat sink.
4Reliability
If ceramic material is used for substrate, then electrical insulation is achieved, but material costs increase
Solution Approach 1:
The patent uses multiple small ceramic substrates instead of one large ceramic substrate. This segmentation significantly reduces the total amount of expensive ceramic material required while maintaining electrical insulation functionality. The smaller substrates use less material per unit, and the overall design optimizes ceramic usage to reduce costs while preserving the essential insulating properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the operating safety and cost-effectiveness of lighting devices by minimizing damage risk, reducing material costs, and enabling efficient heat dissipation while maintaining electrical insulation, thus improving the service life and efficiency of semiconductor light sources.
Implementation Method 1
The substrate consists of a multiplicity of substrate modules provided with conductor tracks for making contact with the respective semiconductor light source, wherein the substrate modules are indirectly or directly brought into contact thermally with a heat sink
Data Source
AI summary
A lighting device may include a plurality of semiconductor light sources arranged on a substrate which is brought into contact thermally with a heat sink, wherein the substrate is formed from a multiplicity of substrate modules which are held by a carrier and which each carry at least one semiconductor light source and are brought into contact electrically with one another.