Segmented Chip Resistor Heat Dissipation

Solution Overview

Problem

High-power chip resistors face issues with heat generation due to current concentration during the laser trimming process, which affects their power characteristics and thermal shock resistance.

Innovation Solution

A chip resistor design featuring an insulating substrate with multiple resistor bodies connected by internal electrodes, which provides excellent heat dissipation and thermal shock resistance, replacing the traditional single resistor body with a serpentine cut formed through trimming.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If a serpentine cut is formed in a resistor body through laser trimming to improve power characteristics, then power characteristics are improved, but heat is generated due to current concentration on the resistor body

Engineering Contradiction:

Improvepower characteristicsVSAvoidheat generation

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The resistor body is divided into multiple segmented resistor bodies (first, second, third, fourth resistor bodies) arranged in parallel. This segmentation distributes the current flow across multiple paths, preventing current concentration at any single location and thereby reducing heat generation while maintaining power characteristics.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single serpentine cut in one dimension to a multi-dimensional parallel arrangement of multiple resistor bodies. The internal electrodes connect these segmented bodies in a three-dimensional configuration, distributing current across multiple spatial dimensions and reducing thermal concentration.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Power

If a serpentine cut is formed in a resistor body through laser trimming, then power characteristics are improved, but thermal shock resistance deteriorates

Engineering Contradiction:

Improvepower characteristicsVSAvoidthermal shock resistance

Core Design Contradiction:

PowerVSReliability

Solution Approach 1:

The resistor body is divided into multiple segmented resistor bodies (first, second, third, fourth resistor bodies) arranged in parallel. This segmentation distributes the current flow across multiple paths, preventing current concentration at any single location and thereby reducing heat generation while maintaining power characteristics.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single serpentine cut in one dimension to a multi-dimensional parallel arrangement of multiple resistor bodies. The internal electrodes connect these segmented bodies in a three-dimensional configuration, distributing current across multiple spatial dimensions and reducing thermal concentration.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If multiple resistor bodies are used to improve heat dissipation, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

Multiple resistor bodies are merged into a single integrated component with unified internal electrodes and external connections. The first and second external electrodes respectively connect to the first and fourth resistor bodies, while the third and second external electrodes connect to the second and third resistor bodies, creating a consolidated structure that simplifies mounting and connection while maintaining heat dissipation benefits.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The internal electrodes serve multiple functions: they electrically connect the segmented resistor bodies in parallel and provide structural support for the entire resistor assembly. This multi-functionality reduces the need for additional connection elements, thereby limiting the increase in device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design efficiently dissipates heat generated by current concentration and enhances thermal shock resistance, improving power characteristics while maintaining a compact size.

Implementation Method 1

a plurality of internal electrodes connecting the plurality of resistor bodies to each other

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

excellent heat dissipation properties and resistance to thermal shock

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11315708B1Chip resistor

Publication Date: 2022.04.26 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A chip resistor includes: an insulating substrate; a resistor portion disposed on one surface of the insulating substrate and including a plurality of resistor bodies spaced apart from each other and a plurality of internal electrodes connecting the plurality of resistor bodies to each other; and a first external electrode and a second external electrode disposed on the one surface of the insulating substrate to be spaced apart from each other and respectively connected to the resistor portion, wherein each of the plurality of resistor bodies has a first end adjacent to the first external electrode and a second end opposing the first end and adjacent to the second external electrode, and each of the first end and the second end of each of the plurality of resistor bodies is connected to one of the plurality of internal electrodes, the first external electrode, or the second external electrode.