Segmented Cleaning Device for Fixed Abrasive Polishing Pads
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Solution Overview
Problem
Current methods for cleaning fixed abrasive polishing pads in chemical mechanical polishing are inefficient in removing micro particles, leading to scratches and defects on semiconductor wafers, as they fail to maintain homogeneous hydraulic pressure and effectively clear particles from the polishing pad.
Innovation Solution
A device with a main body featuring inject orifices for spraying a cleaning liquid and recycle orifices for absorbing the liquid, which are strategically arranged to ensure effective removal of micro particles from the polishing pad, with adjustable rotation speeds and flow rates to optimize cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cleaning methods (single nozzle spraying) are used, then the structure is simple, but the cleaning efficiency is low and micro particles cannot be removed timely
Solution Approach 1:
The cleaning device is segmented into multiple independent nozzles arranged in arrays, with each nozzle responsible for cleaning a specific region of the polishing pad. This segmentation enables parallel cleaning operations across different areas, significantly improving cleaning efficiency and ensuring timely removal of micro particles without requiring an overly complex integrated system.
2Manufacturing precision
If high pressure cleaning is used, then micro particles can be removed, but homogeneous hydraulic pressure cannot be maintained and scratches occur on wafer
Solution Approach 1:
Multiple nozzles are strategically positioned at different locations and angles to provide localized cleaning action across the polishing pad surface. Each nozzle delivers optimized pressure and flow rate tailored to its specific cleaning zone, ensuring uniform hydraulic pressure distribution and effective particle removal without causing scratches on the wafer surface through excessive localized pressure.
Solution Approach 2:
The cleaning system transitions from a single-point pressure application to a distributed multi-dimensional nozzle array. By arranging nozzles in multiple rows and columns with varying angles, the system achieves homogeneous pressure distribution across the two-dimensional polishing pad surface, improving both particle removal efficiency and wafer surface quality simultaneously.
3Productivity
If cleaning liquid flow rate is increased, then particle removal improves, but liquid consumption increases and hydraulic pressure becomes non-homogeneous
Solution Approach 1:
The cleaning liquid delivery system is segmented into multiple nozzles that distribute the total liquid flow across multiple outlets. This segmentation allows the system to achieve high particle removal rates through collective nozzle action while reducing liquid consumption at each individual nozzle, preventing non-homogeneous pressure distribution and waste.
Solution Approach 2:
The system optimizes the flow rate parameters for each nozzle based on its position and cleaning requirements. By adjusting individual nozzle flow rates and pressures as parameters, the system achieves effective particle removal while minimizing overall liquid consumption and maintaining homogeneous hydraulic pressure distribution across the polishing pad.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces scratches on the wafer surface, improves yield, and enhances production efficiency by ensuring timely removal of micro particles from the polishing pad during the chemical mechanical polishing process.
Implementation Method 1
spraying a cleaning liquid through a plurality of inject orifices
Implementation Method 2
recycling the cleaning liquid through a plurality of recycle orifices
Data Source
AI summary
A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body.