Segmented CMP Conditioner Prevents Thermal Deformation
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Solution Overview
Problem
Chemical mechanical polishing conditioners face surface deformation during curing due to thermal expansion coefficient differences between the abrasive layer and substrate, leading to reduced polishing efficiency and service life, and difficulty in maintaining surface flatness.
Innovation Solution
A segment-type chemical mechanical polishing conditioner with a bottom substrate featuring a center protrusion and abrasive units arranged in a discontinuous circular contour, using a binding layer to fix abrasive units of varying sizes and contours, allowing for precise positioning and heat-curing to prevent deformation, and utilizing a locating tool for controlled arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the abrasive layer is fixed to the substrate by brazing or sintering methods, then the abrasive layer is securely attached to the substrate, but the surface of the substrate deforms due to thermal expansion coefficient differences during curing
Solution Approach 1:
The continuous abrasive layer is divided into multiple discrete abrasive units (first abrasive units and second abrasive units) with different grain sizes that are alternately arranged on the dressing face. This segmentation allows each unit to be independently positioned and adjusted, preventing cumulative deformation effects while maintaining secure attachment through the binding layer.
Solution Approach 2:
The abrasive units with different grain sizes (first abrasive units and second abrasive units) are alternately arranged in specific patterns on the conditioning surface. This local variation in abrasive properties allows different regions to serve different functions, with the alternating pattern compensating for thermal expansion differences and maintaining overall surface flatness during curing.
2Ease of operation
If adjusters are used to adjust the height difference between abrasive grain units, then the height can be arbitrarily adjusted, but the device complexity increases with bases, screws, and screw holes
Solution Approach 1:
The complex mechanical adjustment mechanism (bases, screws, screw holes) is completely removed from the design. Instead, the abrasive units are directly fixed to the dressing face through the binding layer at predetermined positions, achieving height control through the arrangement design itself rather than through adjustable mechanical components.
Solution Approach 2:
The abrasive units are designed to be self-positioning on the dressing face through the binding layer arrangement. The alternating pattern of first and second abrasive units with different grain sizes naturally achieves the desired height differences and functional distribution without requiring external adjustment mechanisms or complex assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate deformation, maintains surface flatness, and enhances polishing efficiency and service life by ensuring uniform abrasive distribution and improved debris discharge.
Implementation Method 1
an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate... heating and curing the abrasive unit binding layer to fix the abrasive units to the abrasive unit binding layer
Implementation Method 2
disposing a locating tool having a plurality of locating blocks on the center protrusion... arranging a plurality of abrasive units on the abrasive unit binding layer by the locating tool
Data Source
AI summary
The present invention relates to a segment-type chemical mechanical polishing conditioner and a method for manufacturing thereof. The segment-type chemical mechanical polishing conditioner comprises: a bottom substrate having a center protrusion; an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate; and a plurality of abrasive units placed on the abrasive unit binding layer; wherein the abrasive units have a fan-shaped contour and are arrange along the center protrusion of the bottom substrate to form a discontinuous circular contour. Therefore, the present invention can utilize the center protrusion of the bottom substrate to adjust the arrangements of the abrasive units, and effectively improve the problem of thermal deformation of the surface of the chemical mechanical polishing conditioner during heat-hardening process, thereby enhancing the surface flatness of chemical mechanical polishing conditioner.