Segmented Cold Plate Assembly for Multi-CPU Compatibility

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Solution Overview

Problem

The existing cold plate assemblies for CPUs require redesign and extensive testing when CPUs are iterated or manufactured by different manufacturers, leading to high development costs and long cycles due to their integrated structure.

Innovation Solution

A decoupled heat exchange assembly and holder design, where the heat exchange assembly has an independent cavity and can accommodate multiple CPU types, allowing only the holder to be redesigned, reducing the need for full assembly redesign and testing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the cold plate assembly uses an integrated structure, then the assembly is simple to manufacture, but the entire assembly must be redesigned when CPU types change, leading to high development costs

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidcompatibility with different CPU types
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The cold plate assembly is divided into two independent parts: a holder structure and a heat exchange assembly. The holder structure is designed to adapt to different CPU socket types, while the heat exchange assembly maintains a standardized configuration. This segmentation allows the holder to be redesigned for different CPUs without requiring changes to the heat exchange assembly, thereby reducing development costs while maintaining manufacturing simplicity.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the cold plate assembly is redesigned for each CPU iteration, then the heat dissipation performance is optimized, but the development time and costs increase exponentially

Engineering Contradiction:
Improveheat dissipation performanceVSAvoiddevelopment cycle time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

By separating the holder structure from the heat exchange assembly, only the holder needs to be redesigned for different CPU iterations, while the heat exchange assembly remains standardized. This significantly reduces the development cycle time and costs associated with full assembly redesign, while still allowing optimization of heat dissipation performance through holder-specific design adjustments.

Inventive Principle:
Principle #1Segmentation

3Manufacturing precision

If the entire cold plate assembly is redeveloped for different manufacturers, then the fit and heat transfer are optimized, but the development costs increase

Engineering Contradiction:
Improvefit precisionVSAvoidmulti-manufacturer compatibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The holder structure is designed to accommodate different CPU socket specifications from various manufacturers, while the heat exchange assembly maintains a standardized interface. This allows the holder to be customized for precise fitting with different manufacturers' CPUs, while the standardized heat exchange assembly ensures multi-manufacturer compatibility without requiring full assembly redevelopment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat exchange assembly is designed as a universal component that can work with different CPU types through the standardized holder interface. This universal design enables the same heat exchange assembly to serve multiple CPU manufacturers and iterations, reducing development costs while maintaining appropriate fit precision through holder-specific adaptations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach shortens development cycles and reduces costs by enabling the heat exchange assembly to cover various CPU generations without repeated redesign and testing, while maintaining effective heat dissipation.

Implementation Method 1

The CPU may exchange heat with a cooling medium in the cold plate assembly, and the cooling medium takes away heat generated by the CPU

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the cooling medium takes away heat generated by the CPU in a circularly flowing process

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20250290700A1Heat Exchange Assembly, Cold Plate Assembly, and Terminal Device
Publication Date: 2025.09.18 HUAWEI CLOUD COMPUTING TECHNOLOGIES CO LTD
  • US20250290700A1 patent drawing
  • US20250290700A1 patent drawing
  • US20250290700A1 patent drawing

AI summary

A heat exchange assembly includes a main part and a positioning part. The main part has a heat exchange cavity that is configured to accommodate a cooling medium, and a liquid inlet and a liquid outlet that are connected to the heat exchange cavity. The positioning part is configured to fit a first fitting part disposed on a holder, to position relative positions of the holder and the heat exchange assembly. A cold plate assembly includes the heat exchange assembly and the holder. The holder includes a body part and the first fitting part. The body part is configured to enable the first fitting part to abut against the positioning part of the heat exchange assembly, so that the main part of the heat exchange assembly abuts against a heat generating component.