Segmented Computer Housing for Thermal Management and Mounting

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Solution Overview

Problem

Existing computer housings face challenges in efficiently dissipating heat and securely mounting to support arms, leading to potential overheating and mechanical stress.

Innovation Solution

A computer housing design featuring a U-shaped configuration with spaced wall sections that allow for a support arm between the second and third wall sections, incorporating cooling elements and fastening mechanisms to reduce stress and facilitate cooling, while ensuring secure mounting and protection from environmental contaminants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the computer housing uses a conventional enclosed design, then structural strength is improved, but heat dissipation capability deteriorates

Engineering Contradiction:
Improvestructural strengthVSAvoidheat dissipation capability
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The housing wall is segmented into multiple wall sections (first, second, third wall sections) that partially enclose different housing interior sections. This segmentation creates open spaces between wall sections that allow air flow for heat dissipation while maintaining structural integrity through the distributed wall framework.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different wall sections have different enclosure functions - the first wall section encloses the first housing interior section while leaving the second and third wall sections spaced apart to create cooling channels. This local differentiation allows simultaneous structural strength and heat dissipation capability.

Inventive Principle:
Principle #3Local quality

2Volume of moving object

If the computer housing uses a compact design, then space utilization is improved, but mounting stability on support arm deteriorates

Engineering Contradiction:
Improvespace utilizationVSAvoidmounting stability
Core Design Contradiction:
Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The support arm is positioned to extend between the second and third wall sections in a spatial arrangement that optimizes both compactness and stability. This dimensional positioning allows the center of gravity to be shifted toward the support arm mounting location, improving stability without increasing overall housing volume.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If cooling elements are added to the housing, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

Cooling elements are merged with existing wall sections rather than being separate components. The cooling elements are integrated into the second and/or third wall sections, combining the structural housing function with the thermal management function in a single integrated structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The wall sections serve multiple functions - they provide structural enclosure, define housing interior sections, and incorporate cooling elements for heat dissipation. This multi-functionality reduces overall device complexity by eliminating the need for separate cooling system components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively reduces mechanical stress and heat buildup, providing reliable cooling and secure mounting, thus enhancing the operational stability and hygiene compatibility of computer systems.

Implementation Method 1

at least one cooling element is provided on at least one of the wall sections, which is designed to dissipate heat input through a component arranged in the housing interior corresponding to the wall section and to cool the component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

If the cooling element also runs essentially in the direction of gravity, a chimney effect occurs, so that particularly good cooling of the computer components is ensured

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP2886928B1Computer case, computer with such a computer case and a control system with such a computer
Publication Date: 2019.01.09 BECKHOFF AUTOMATION GMBH
  • EP2886928B1 patent drawingFigure 1
  • EP2886928B1 patent drawingFigure 2
  • EP2886928B1 patent drawingFigure 3

AI summary

The invention relates to a computer housing 60, a computer 15 with such a computer housing 60, and an operating system 10 with such a computer 15, wherein a housing wall 65 is provided for enclosing a housing interior 70 with a first, a second, and a third housing interior section 95, 100, 105, wherein the housing wall 65 has a first wall section 80, a second wall section 85, and a third wall section 90, wherein the first wall section 80 at least partially encloses the first housing interior section 95, the second wall section 85 the second housing interior section 100, and the third wall section 90 the third housing interior section 105, wherein each housing interior section 95, 100, 105 is configured to receive a component 110, 115, 120 of a computer 15, wherein the second wall section 85 and the third wall section are arranged 90 apart from each other,wherein the second wall section 85 and the third wall section 90 are arranged adjacent to the first wall section 80 and extend away from the first wall section 80.