Segmented Conductive Fence EMI Shield for SiP Modules
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Solution Overview
Problem
Current EMI shielding solutions for system-in-a-package (SiP) modules, such as electrically-conductive metal cans, are impractical due to space constraints in modern electronic devices like smartphones, as they fail to effectively shield radio frequency (RF) functional blocks from interfering with each other within the module package.
Innovation Solution
A compartment EMI shield comprising a conductive fence arranged along the compartment boundary, with substantially vertical conductive structures electrically coupled to a common ground structure, effectively attenuates EMI between RF functional blocks without occupying excessive space by using a wire cage or conductive horizontal bars that are strategically positioned to minimize contact with other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electrically-conductive metal cans are used for EMI shielding, then EMI shielding effectiveness is improved, but device size and space consumption increase
Solution Approach 1:
The patent divides the EMI shielding function into segmented conductive structures (fences, bars, or plates) arranged in arrays rather than using a single solid metal can. These segmented structures provide adequate EMI shielding while occupying less space and allowing better integration within the SiP module package.
Solution Approach 2:
The patent employs thin conductive structures (fences, bars, or plates) that act as EMI shields without requiring the bulkiness of traditional metal cans. These thin conductive elements provide the necessary shielding effectiveness while minimizing space consumption and enabling thinner form factors.
2Volume of moving object
If SiP module size is reduced to meet space constraints, then space utilization is improved, but EMI shielding capability deteriorates
Solution Approach 1:
The conductive EMI shielding structures are segmented into multiple smaller elements (fences, bars, or plates) arranged in arrays. This segmentation allows the shielding function to be maintained in a compact form factor, as the distributed conductive elements provide effective EMI protection without requiring large volumes.
Solution Approach 2:
The patent transitions from three-dimensional solid metal can shields to two-dimensional array arrangements of conductive fences, bars, or plates. This dimensional change enables effective EMI shielding within the reduced space constraints of modern SiP modules while maintaining shielding capability through the distributed nature of the conductive elements.
3Object-affected harmful factors
If compartment EMI shielding is implemented, then EMI interference between RF functional blocks is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple conductive elements (fences, bars, or plates) into integrated EMI shielding structures that can be manufactured as single pieces or pre-assembled units. This merging approach reduces manufacturing complexity compared to assembling multiple separate shielding components, while still providing effective compartmentalization for EMI protection between RF functional blocks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective EMI shielding within the module package, accommodating thinner form factors and smaller dimensions of SiP modules while maintaining efficient space utilization and cost-effectiveness.
Implementation Method 1
A compartment EMI shield comprising a conductive fence arranged along the compartment boundary, with substantially vertical conductive structures electrically coupled to a common ground structure, effectively attenuates EMI between RF functional blocks
Data Source
AI summary
A system module package is disclosed. The system module package includes: a substrate; a first electrical component and a second electrical component disposed on a top surface of the substrate; and a plurality of bond wires disposed adjacent to at least a first side of the first electrical component and in between the first and second electrical components. The plurality of bond wires are configured to attenuate EMI of a frequency of interest traveling from the first electrical component toward the second electrical component, or from the second electrical component toward the first electrical component. Each of the plurality of bond wires has at least a first end that is mechanically coupled to the top surface of the substrate and has a highest point that is a height, H, from the top surface of the substrate. The plurality of bond wires is of substantially equal lengths measured from the top surface of the substrate to the highest points of the plurality of bond wires in a direction substantially normal to the top surface of the substrate.