Segmented Conductive Pad Structure for Miniaturized Electrical Connections
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Solution Overview
Problem
Existing electronic devices face challenges in achieving reliable and efficient electrical connections due to the need for miniaturization to meet higher resolution and display quality requirements, which affects the conduction capability and reliability of the electrical connection structure.
Innovation Solution
The electronic device incorporates an electrical connection structure with a first and second substrate, conductive pads, a through hole, and conductive material, where the conductive pads have multiple sub-parts allowing for lateral electrical connections, increasing contact points, and reducing the difficulty of the wiring process, thereby improving reliability and allowing for miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the electrical connection structure is miniaturized to meet higher resolution requirements, then the display quality and resolution are improved, but the reliability and conduction capability of the electrical connection structure deteriorate
Solution Approach 1:
The first conductive pad is divided into multiple sub-parts (first sub-part, second sub-part, third sub-part) arranged in different directions. This segmentation allows the conductive pad to maintain sufficient contact area with the conductive material while reducing the overall footprint of the electrical connection structure, thus enabling miniaturization without sacrificing reliability.
Solution Approach 2:
The conductive pads are designed with sub-parts extending in different directions (first direction, second direction, third direction) to create a three-dimensional contact configuration. This dimensional approach increases the contact points between conductive pads and conductive material within a smaller planar footprint, resolving the contradiction between miniaturization and connection reliability.
2Measurement precision
If the electrical connection structure is miniaturized, then the display quality is improved, but the conduction capability deteriorates
Solution Approach 1:
The conductive pad is segmented into multiple sub-parts that can be filled with conductive material independently. This segmentation ensures that even if one sub-part has imperfect filling, other sub-parts can compensate, maintaining overall conduction capability while allowing for a smaller total structure size.
Solution Approach 2:
Different sub-parts of the conductive pad are positioned to contact the conductive material at different locations and orientations. This local quality variation ensures that the conductive material can effectively fill and contact multiple sub-parts, maintaining conduction capability within a miniaturized structure.
3Reliability
If the conductive pad has multiple sub-parts, then the reliability and process yield are improved, but the device complexity increases
Solution Approach 1:
The conductive pad is divided into multiple sub-parts that can be manufactured using standard photolithography and patterning processes. While the structure is segmented, each sub-part follows a similar design pattern, allowing for automated manufacturing and reducing the actual complexity increase despite the multi-part configuration.
Data Source
AI summary
An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes at least two sub-parts, and the at least two sub-parts respectively include a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole passes through the first substrate and exposes a portion of the second upper surface. Furthermore, the conductive material is partially disposed in the through hole and in contact with at least one first upper surface and the second upper surface.