Segmented Conductive Posts for Power Semiconductor Heat and Noise Management
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Solution Overview
Problem
In power semiconductor apparatuses, the high heat production and strong electric fields from power semiconductor devices pose challenges in protecting electronic components on substrates, requiring increased distance and reliability, which existing high-speed Cu plating technologies cannot achieve due to limitations in post height and manufacturing cost.
Innovation Solution
The apparatus includes a conductive circuit pattern, a power semiconductor device, and conductive posts with metal pins and bonding members to enhance the height and reliability, with a method involving bonding, sealing, and forming conductive posts within a sealing member to increase the distance between the power semiconductor device and electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the height of the post is increased to protect electronic components from heat and electromagnetic noise, then the reliability is improved, but the manufacturing time and cost increase
Solution Approach 1:
The post is divided into multiple segments (first post body, second post body, third post body) with different materials and functions. Each segment serves a specific purpose: the first segment provides mechanical support and electrical connection, the second segment provides thermal management through high thermal conductivity, and the third segment provides electromagnetic shielding. This segmentation allows each part to be optimized independently, achieving high reliability without excessive overall height.
Solution Approach 2:
The post uses composite material construction with different sections made from materials optimized for specific functions. The first post body uses a conductive material for electrical connection, the second post body uses a material with high thermal conductivity for heat dissipation, and the third post body uses a material with high electromagnetic wave shielding effectiveness. This composite approach achieves multiple performance goals simultaneously without requiring uniform increases in post height throughout.
2Object-affected harmful factors
If the height of the post is increased to increase distance from electronic components, then the adverse effects of electromagnetic noise are reduced, but the manufacturing cost increases
Solution Approach 1:
Instead of uniformly increasing post height everywhere, the invention applies electromagnetic shielding specifically where needed. The third post body is designed with high electromagnetic wave shielding effectiveness material concentrated in the region most susceptible to electromagnetic interference. This localized approach reduces electromagnetic noise effects without the excessive cost of uniformly increasing the entire post height.
Solution Approach 2:
The post structure acts as an intermediary element between the power semiconductor device and the electronic component. By incorporating electromagnetic shielding material in the third post body, it mediates the electromagnetic interaction, blocking harmful electromagnetic noise while allowing necessary thermal and electrical functions to pass through. This intermediary function achieves protection without requiring excessive distance or post height.
3Reliability
If the post height is increased to prevent dielectric breakdown in insulating members, then the reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
The post is segmented into functional sections, with each segment addressing specific reliability concerns. The first segment handles electrical connection, the second segment handles thermal management, and the third segment provides electromagnetic shielding and electrical insulation. This segmentation allows each part to be optimized for its specific function, achieving reliable prevention of dielectric breakdown without excessive overall structural complexity.
Solution Approach 2:
Different segments of the post use different materials optimized for specific functions. The use of composite materials allows each segment to provide its required function (electrical conduction, thermal conduction, electromagnetic shielding, insulation) without requiring the entire post structure to be overly complex or excessively tall.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability of power semiconductor apparatuses by increasing the height of conductive posts, reducing adverse effects of electromagnetic noise, and enhancing thermal dissipation, while allowing for efficient current handling and increased electrical capacity.
Implementation Method 1
The first conductive bonding member fills between a first pin side surface of the first metal pin and a first side surface of the first hole and bonds the first metal pin to the conductive circuit pattern
Implementation Method 2
enhancing thermal dissipation
Implementation Method 3
The sealing member seals the first main surface of the conductive circuit pattern and the power semiconductor device
Implementation Method 4
enhancing thermal dissipation
Data Source
AI summary
A power semiconductor apparatus includes a conductive circuit pattern, a power semiconductor device, a sealing member, a conductive post, and a conductive post. A first conductive post is connected to the conductive circuit pattern. A second conductive post is connected to the power semiconductor device. The first conductive post includes a metal pin and a conductive bonding member. The conductive post includes a metal pin and a conductive bonding member.