Segmented Conductor Shield for Intra-Module RF Isolation in FOWLP
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Solution Overview
Problem
Conventional fan-out wafer level packaging (FOWLP) modules lack intra-module shielding between chips, as the ground shielding is limited by being positioned outside the chips and unable to effectively shield electromagnetic interference between embedded circuits.
Innovation Solution
A fan-out wafer level package (FOWLP) with a conductor shield that surrounds each chip and is directly connected to the conductor portions of the package, providing immediate ground shielding between chips, thereby addressing the lack of intra-module shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional metal shield surrounds the mold covering all chips, then inter-module shielding is provided, but intra-module shielding between different chips is not achieved
Solution Approach 1:
The patent divides the shielding structure into multiple segments, with each chip having its own dedicated ground shield that immediately surrounds it. This segmentation allows each chip to be individually shielded from electromagnetic interference from adjacent chips, achieving intra-module shielding that was not possible with a single conventional shield surrounding the entire mold.
Solution Approach 2:
The patent transitions from a two-dimensional planar shield configuration to a three-dimensional structure where ground shields extend vertically to immediately surround each chip. This dimensional change allows the shields to be positioned much closer to the chip circuits, dramatically improving shielding effectiveness within the module.
2Ease of manufacture
If ground shielding planes are positioned to surround the outer surfaces of the mold, then the structure is simple to manufacture, but the grounding effect is limited due to considerable distance from embedded circuits
Solution Approach 1:
The shielding structure is segmented into multiple ground shields, each associated with a specific chip. This segmentation enables the shields to be positioned immediately adjacent to each chip during the molding process, achieving close proximity to embedded circuits while maintaining manufacturing simplicity through the use of standard molding techniques.
Solution Approach 2:
The patent introduces mold cavities as intermediaries that facilitate the formation of ground shields in close proximity to chips. The mold cavities are positioned between the chips and the outer mold surfaces, allowing ground shields to be formed in these intermediate spaces, thereby achieving close grounding effect without complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves effective intra-module shielding, preventing electromagnetic interference between chips and ensuring reliable operation of digital, analog, or RF circuits within the same module by grounding the conductor shield directly.
Implementation Method 1
a conductor shield comprising a plurality of conductor surfaces, wherein at least one of the conductor surfaces is directly connected to said at least one conductor portion of the FOWLP directly opposite the gap between the first chip and the second chip, wherein at least one of the conductor surfaces immediately surrounds the first chip, and wherein at least one of conductor surfaces immediately surrounds the second chip
Data Source
AI summary
Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a fan-out wafer level package (FOWLP) module or device. Intra-module shielding between individual chips within the FOWLP module or device is achieved by electromagnetic or radio-signal (RF) isolation provided by the surfaces of the conductor shield immediately surrounding each of the chips. The conductor shield is directly connected to one or more grounded conductor portions of a FOWLP to ensure reliable grounding.