Segmented Connecting Substrate for COG Display Termination Resistor Adjustment
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Solution Overview
Problem
In liquid crystal displays using COG and TCP configurations, changing the resistance value of termination resistors is difficult and costly, as it often requires replacing the entire connecting substrate, leading to increased component and manufacturing costs.
Innovation Solution
The connecting substrate is divided into a first substrate with lines for all driver chips except the terminating area and a second substrate with lines and termination resistors for the terminating area, allowing only the second substrate to be replaced when resistance values are adjusted, thereby reducing costs and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the termination resistor is integrated on the same connecting substrate as the signal lines, then the electrical connection and signal transmission are simplified, but changing the resistance value requires replacing the entire substrate which increases cost and complexity
Solution Approach 1:
The connecting substrate is divided into two separate substrates: a first connecting substrate for signal transmission and a second connecting substrate for termination resistance. This segmentation allows independent selection and replacement of the second substrate when resistance values need to be changed, without affecting the first substrate and signal lines.
Solution Approach 2:
The patent introduces an intermediate structure where the second connecting substrate acts as a mediator between the signal lines and the driver chip. This intermediate substrate specifically handles termination functions, allowing flexible resistance value selection through different substrate configurations without modifying the main signal transmission path.
2Adaptability or versatility
If the termination resistor is mounted as a separate component on the connecting substrate, then the resistance value can be easily changed, but the device structure becomes more complex and manufacturing costs increase
Solution Approach 1:
The patent merges the termination resistance function with a dedicated second connecting substrate, integrating the resistance functionality into the substrate structure itself rather than using separate discrete components. This reduces overall structural complexity while maintaining resistance value adaptability through substrate design variations.
Solution Approach 2:
The patent applies local quality by creating a specialized second connecting substrate with specific resistance characteristics tailored for termination purposes. This localized optimization allows different resistance values to be achieved through substrate design rather than component selection, simplifying the overall structure.
3Manufacturing precision
If the entire connecting substrate is replaced to change termination resistance values, then the correct impedance matching is achieved, but manufacturing time and costs increase significantly
Solution Approach 1:
By segmenting the connecting substrate into first and second substrates, the patent enables selective replacement of only the second substrate when impedance matching adjustments are needed. This maintains manufacturing precision for impedance matching while significantly improving productivity by avoiding complete substrate replacement.
Solution Approach 2:
The patent introduces dynamic flexibility to the system architecture, allowing the second connecting substrate to be independently configured or replaced based on specific impedance requirements. This dynamic approach enables efficient manufacturing by producing different second substrates in advance for different applications without reworking the entire connecting substrate.
4Device complexity
If multiple driver chips are connected through a single connecting substrate, then the signal distribution is simplified, but the transmission line impedance control becomes more difficult
Solution Approach 1:
The patent segments the connection architecture into first connecting substrate for multi-driver signal distribution and a second connecting substrate for termination. This segmentation maintains simple signal distribution across multiple drivers while enabling precise impedance control at the termination end through the specialized second substrate.
Solution Approach 2:
The patent applies local quality by creating a specialized second connecting substrate with optimized termination characteristics for each driver chip location. This allows precise impedance control at each local termination point while maintaining the simplified overall signal distribution architecture through the first substrate.
Data Source
AI summary
Disclosed is a display device including: a display panel on which a plurality of driver chips are mounted by using a COG configuration; a signal substrate on which a timing controller for generating a differential signal inputted into each of the driver chips is formed; and a connecting substrate which connects the plurality of driver chips with the timing controller, wherein the connecting substrate includes a first connecting substrate on which a first line for inputting the differential signal into a driver chip excluding a driver chip located at a terminating area is formed and a second connecting substrate on which a second line for inputting the differential signal into the driver chip located at the terminating area, and wherein a termination resistor connects the second line for transmitting the differential signal which is formed on the second connecting substrate.