Plate Cooling Device with Segmented Contact Pads for Wafer De-Bonding
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Solution Overview
Problem
Existing wafer thinning processes face issues with carrier plate adhesion to cooling platforms, leading to pickup failures and deformation during transfer, due to large adhesive areas causing excessive force.
Innovation Solution
A plate cooling device with protruding contact pads covering less than 3% of the carrier plate area, combined with a de-bonding station design featuring guiding pieces and linear actuators, allows controlled adhesion and transfer of the carrier plate without warping or rupture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the carrier plate is placed on the cooling platform with large area contact, then the cooling effect is improved, but the adhesive force becomes excessive causing pickup failure
Solution Approach 1:
The cooling platform surface is segmented into multiple discrete contact pads instead of a continuous large-area surface. The contact pads are distributed across the platform with each pad having an area of 1-10 mm², totaling less than 3% of the carrier plate area. This segmentation reduces the total adhesive contact area while maintaining cooling functionality through the distributed pads that conduct heat from the carrier plate to the platform.
Solution Approach 2:
The cooling platform exhibits non-uniform surface properties with localized contact regions (contact pads) having high thermal conductivity for heat dissipation, while the intervening areas have low or zero adhesive contact. This local quality differentiation allows the carrier plate to be cooled effectively at discrete points without experiencing excessive adhesive force across the entire surface area.
2Force
If the adhesive force is increased to remove the carrier plate from the cooling platform, then the carrier plate can be detached, but the carrier plate warps or deforms
Solution Approach 1:
By segmenting the cooling platform into discrete contact pads, the adhesive force is distributed across multiple small points rather than concentrated over a large area. This allows the carrier plate to be easily detached by applying minimal force at any single contact point, preventing warping or deformation of the carrier plate structure.
3Reliability
If manual elimination of errors is required due to pickup failure, then the process can be corrected, but the productivity decreases
Solution Approach 1:
The segmented contact pad design ensures reliable pickup by distributing adhesive forces to prevent excessive bonding, thereby eliminating pickup failures that would require manual intervention and reduce productivity.
Solution Approach 2:
The contact pad structure enables the carrier plate to be automatically and reliably picked up and transferred without requiring manual error correction, as the controlled adhesive force naturally prevents pickup failures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents pickup failures and reduces error rates in the de-bonding process, enhancing production efficiency by ensuring controlled adhesion and safe transfer of the carrier plate.
Implementation Method 1
the carrier plate is placed on the cooling platform for cooling and recycling
Implementation Method 2
The vacuum chuck is provided in the de-bonding section for vacuum absorbing the wafer
Implementation Method 3
the pickup head is movably disposed on the horizontal beam for vacuum adsorbing the carrier plate
Data Source
AI summary
A plate cooling device for cooling carrier plate of a wafer, includes a cooling plate and a plurality of contact pads. The cooling plate includes an upper surface; wherein the upper surface is provided with a cooling area for placing the wafer thereon. The contact pads are disposed on the upper surface. The contact pads protrude on the upper surface, and the total area of the contact pads is less than 3% of the area of the carrier plate.