Segmented Cooling Body for Noise Suppression in Electronic Devices
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Solution Overview
Problem
Electronic devices face challenges in reducing noise emissions due to the heat radiation layers used for cooling, which often interfere with the capacitor function and fail to effectively manage noise from electronic elements.
Innovation Solution
An electronic device design featuring a cooling body with a divided part that abuts on the heat dissipation layer, comprising multiple divided regions and groove parts, which reduces the contact area and increases resistance between the cooling body and heat dissipation layer, thereby suppressing noise emissions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat radiation layer is provided on the back surface of the electronic module to cool embedded electronic elements, then heat dissipation is improved, but noise is discharged to the outside of the electronic module via the heat radiation layer
Solution Approach 1:
The cooling body is divided into multiple divided regions with groove parts between them, creating a segmented structure that reduces continuous contact area with the heat dissipation layer, thereby suppressing noise discharge while maintaining heat dissipation effectiveness
Solution Approach 2:
The divided part of the cooling body creates different contact characteristics at different locations - the abutting parts maintain good thermal contact for heat dissipation, while the groove parts reduce contact area to suppress noise discharge to the outside
2Object-generated harmful factors
If the cooling body has a divided part with multiple divided regions and groove parts, then noise discharge is suppressed by reducing contact area, but heat dissipation efficiency may be reduced
Solution Approach 1:
The cooling body is segmented into multiple divided regions connected by groove parts, creating a structure that balances noise suppression through reduced contact area while maintaining heat dissipation through the divided structure's overall thermal conductivity
Solution Approach 2:
The divided part's geometry (groove depth, width, and pattern) is optimized to achieve the right balance between reducing contact area for noise suppression and maintaining sufficient thermal contact for effective heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses noise emissions by increasing resistance between the heat dissipation layer and the cooling body, while maintaining efficient heat dissipation, particularly for electronic devices with switching elements that generate noise and heat.
Implementation Method 1
a cooling body which abuts on the heat dissipation layer; the divided part may have abutting parts that abut on the heat dissipation layer
Data Source
AI summary
An electronic device has an electronic module having an insulating substrate 60, a conductor layer 20 provided on the insulating substrate 60, an electronic element 40 provided on the conductor layer 20 and a heat dissipation layer 10 provided on the insulating substrate in an opposite side of the electronic element 40 and a cooling body 100 which abuts on the heat dissipation layer 10. The cooling body 100 has a divided part 110 being provided at a portion which abuts on the heat dissipation layer 10 and being a plurality of divided regions.