Segmented Cooling Channels in Multi-Chip Semiconductor Packages
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Solution Overview
Problem
The increased integration and miniaturization of semiconductor chips in a single package lead to heat generation issues, hindering performance and causing thermal stress due to inadequate cooling solutions in conventional semiconductor packages.
Innovation Solution
A semiconductor package design incorporating a cooling system with a package substrate, interposer, semiconductor chips, a molding layer, barrier layer, separation wall, and a heat dissipation structure that utilizes a cooling fluid to flow between defined cooling spaces, enhancing heat dissipation through a network of channels and apertures for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are integrated in a single package to meet performance and price requirements, then the functionality and integration density are improved, but heat generation increases causing thermal stress and performance degradation
Solution Approach 1:
The cooling system is segmented into multiple independent cooling channels, with each channel dedicated to cooling specific semiconductor chips. The separation wall divides the cooling spaces into first and second cooling spaces, allowing independent temperature control for different chip regions. This segmentation enables targeted cooling of high-heat-generation areas without affecting other regions, effectively managing heat from multiple integrated chips.
Solution Approach 2:
A cooling fluid acts as an intermediary medium between the semiconductor chips and the heat dissipation structure. The cooling fluid flows through the cooling channels, absorbing heat from the chips and transporting it to the heat dissipation structure. This intermediary approach enables efficient heat transfer while maintaining physical separation between the heat source (chips) and the heat dissipation mechanism.
2Device complexity
If conventional cooling solutions are used in semiconductor packages, then the structure remains simple, but heat dissipation is inadequate leading to thermal stress
Solution Approach 1:
The cooling system transitions from conventional two-dimensional surface cooling to three-dimensional volumetric cooling. Cooling channels are formed within the molding layer, creating vertical cooling spaces that extend through the package thickness. The separation wall creates distinct vertical cooling zones above different chip regions, enabling heat dissipation from multiple levels and improving thermal management efficiency.
Solution Approach 2:
The system utilizes hydraulic principles by implementing a closed-loop liquid cooling system. Cooling fluid is pumped through channels formed in the molding layer, with inlet and outlet channels enabling continuous fluid circulation. The separation wall with through-holes allows controlled fluid communication between different cooling spaces, creating an integrated hydraulic cooling network that efficiently removes heat from multiple chips.
3Reliability
If cooling fluid channels are integrated into the molding layer, then cooling efficiency is improved, but the manufacturing process becomes more complex
Solution Approach 1:
Cooling channels are pre-formed within the molding layer during the molding process itself, rather than being added as separate post-processing components. The mold cavity is designed to create cooling channels and cooling spaces as integral parts of the molding layer structure. This preliminary action integrates cooling functionality into the base manufacturing process, avoiding complex secondary operations while maintaining high cooling efficiency.
Solution Approach 2:
The molding layer serves multiple functions: it encapsulates and protects the semiconductor chips, provides structural support, and simultaneously forms the cooling channels and cooling spaces. The separation wall, also formed during molding, both separates different cooling zones and enables fluid communication between them. This multi-functionality reduces the need for additional components and manufacturing steps, simplifying production while achieving effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces thermal coupling between chips and improves cooling efficiency by using a cooling fluid to manage heat generated by multiple semiconductor chips, preventing overheating and thermal fatigue, thus enhancing the reliability and performance of semiconductor packages.
Implementation Method 1
a cooling channel in fluid communication with the inlet, the first cooling space and the second cooling space, wherein the cooling channel is configured to receive the cooling fluid from the inlet and direct the cooling fluid into the first cooling space and the second cooling space
Implementation Method 2
a cooling fluid to flow between the first cooling space and the second cooling space
Data Source
AI summary
A semiconductor package includes a package substrate; an interposer on the package substrate; a first semiconductor chip on the interposer; at least one second semiconductor chip on the interposer; a molding layer extending around the first semiconductor chip and the at least one second semiconductor chip; a barrier layer on the upper surface of the molding layer; a separation wall on the barrier layer, the separation wall configured to define a first cooling space adjacent the first semiconductor chip and a second cooling space adjacent the at least one second semiconductor chip; and a heat dissipation structure on the separation wall, wherein the heat dissipation structure provides a cooling channel through which the cooling fluid flows.