Segmented Semiconductor Cooling Units with Thermal Reservoirs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current cooling devices for therapeutic purposes, such as ice packs, lack advanced control mechanisms and efficient heat management systems, leading to suboptimal cooling performance and user experience.
Innovation Solution
A cooling device comprising semiconductor cooling elements sandwiched between substrates, connected to device electronics that manage power delivery and incorporate thermal reservoirs for efficient heat dissipation, allowing for customizable cooling profiles and improved temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If semiconductor cooling elements are used with controlled power delivery, then cooling performance and temperature regulation are improved, but device complexity increases due to electronics and control systems
Solution Approach 1:
The cooling device is divided into multiple independent cooling units, each with its own semiconductor cooling elements and control circuitry. This segmentation allows for localized temperature control and enables the system to manage complexity through modular design, where each unit can be controlled independently according to specific cooling profiles.
Solution Approach 2:
The device employs dynamic power delivery control to the semiconductor cooling elements, adjusting electrical parameters in real-time based on thermal feedback and predefined cooling profiles. This dynamic control optimizes cooling performance while managing energy consumption and heat dissipation requirements.
2Duration of action of stationary object
If thermal reservoirs are incorporated for heat dissipation, then duration of cooling action is improved, but device complexity and energy management requirements increase
Solution Approach 1:
Thermal reservoirs are pre-positioned within the device structure to accumulate and manage heat before it reaches critical levels. These reservoirs act as thermal buffers that extend the duration of cooling action by storing excess heat energy, allowing the cooling system to operate more efficiently over extended periods.
Solution Approach 2:
The thermal reservoirs serve as intermediary components between the semiconductor cooling elements and the external environment, mediating heat transfer and providing thermal management. This intermediary function extends cooling duration while simplifying the overall thermal management architecture.
3Adaptability or versatility
If multiple cooling units with customizable profiles are implemented, then adaptability and user comfort are improved, but device complexity and power management requirements increase
Solution Approach 1:
The cooling device is divided into multiple independent cooling units, each with its own semiconductor cooling elements and control circuitry. This segmentation allows for localized temperature control and enables the system to manage complexity through modular design, where each unit can be controlled independently according to specific cooling profiles.
Solution Approach 2:
The device electronics are designed with universal control capabilities that can manage multiple cooling units through a unified control architecture. The system can store and execute multiple cooling profiles, allowing a single device to serve various therapeutic applications and user preferences without requiring separate control systems for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides enhanced cooling performance by maintaining lower temperatures for longer periods, offering customizable cooling zones and profiles, and integrating sensors for adaptive cooling based on user conditions, thereby improving therapeutic efficacy and user comfort.
Implementation Method 1
Each cooling unit comprises a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate. The device electronics are configured to deliver power to the cooling units to cool the user's body. The delivery of power to the cooling units causes the transfer of heat from the first cooling unit substrates to the second cooling unit substrates.
Implementation Method 2
The thermal reservoir material is in contact with the second cooling unit substrates.
Data Source
AI summary
A cooling device includes a package substrate, a plurality of cooling units, and device electronics. The plurality of cooling units are configured to cool a user's body. Each cooling unit includes a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate. Each of the cooling units is connected to the package substrate. The device electronics are coupled to the cooling units. The device electronics are configured to store a first cooling device profile that includes data indicating an amount of power to deliver to each of the cooling units over a period of time. The device electronics are configured to deliver power to the cooling units according to the first cooling device profile, wirelessly receive a second cooling device profile from an external computing device, and deliver power to the cooling units according to the second cooling device profile.