Segmented Cover Ring Positioning for Uniform Plasma Treatment
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Solution Overview
Problem
Existing semiconductor device manufacturing processes often result in non-uniform plasma treatment across the substrate surface, leading to defects in semiconductor devices.
Innovation Solution
A plasma treatment apparatus with a cover ring and moving mechanism that adjusts the position of the cover ring to ensure uniform plasma treatment across the substrate surface, using a control unit to manage the movement based on target life and film thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a cover ring is used in plasma treatment, then film thickness uniformity is improved, but device complexity increases due to additional components and movement mechanisms
Solution Approach 1:
The cover ring is designed with movable segments that can dynamically adjust their radial positions during plasma treatment. The moving mechanism allows the cover ring to change its configuration from a static obstacle to a dynamic flow guide, enabling uniform plasma distribution while maintaining a relatively simple overall structure.
Solution Approach 2:
The cover ring is divided into multiple movable segments rather than being a single rigid structure. This segmentation allows each segment to independently adjust its position, creating flexible plasma flow paths that improve film thickness uniformity without requiring a complex multi-component system.
2Device complexity
If the cover ring position is fixed, then device complexity is reduced, but plasma treatment uniformity deteriorates due to non-uniform plasma distribution
Solution Approach 1:
The cover ring transitions from a fixed static structure to a dynamic adjustable structure. By enabling radial movement of the cover ring segments, the system achieves uniform plasma distribution without requiring complex multi-component assemblies, as the single movable cover ring can adapt its position to optimize plasma flow.
3Productivity
If plasma treatment is performed without cover ring movement, then processing time is reduced, but film thickness uniformity deteriorates leading to device defects
Solution Approach 1:
The cover ring is pre-positioned in optimal radial locations before plasma treatment begins. This preliminary positioning ensures that plasma flows uniformly across the substrate surface from the start of processing, achieving both film thickness uniformity and efficient processing time without requiring complex real-time adjustments during treatment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the uniformity of plasma treatment, preventing defects by ensuring consistent film thickness across the substrate, enhancing the quality of semiconductor devices.
Implementation Method 1
The plasma generator is configured to generate plasma above the stage on which the substrate is placed
Data Source
AI summary
According to one embodiment, a plasma treatment apparatus includes a treatment chamber for applying treatment to a substrate of a semiconductor device, a stage on which the substrate is placed, a plasma generator, a first annular member, and a first moving mechanism. The first annular member is disposed around the substrate placed on the stage. The first annular member is divided into first annular member pieces arranged in a circumferential direction. The first moving mechanism moves the first annular member to a position at which the first annular member is concentric with the substrate. The first annular member is moved by moving each of the first annular member pieces in a radial direction of the substrate. The first moving mechanism relatively changes a horizontal distance between an end of the substrate and an inner end of the first annular member.