Segmented CoWoS Interposer Layout to Reduce Warpage Stress
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Solution Overview
Problem
The semiconductor industry faces challenges in packaging semiconductor dies due to warpage and stress issues in large interposers, which can lead to cracking or delamination when bonding to substrates, especially as integration density increases.
Innovation Solution
The use of multiple smaller interposers instead of a single large one, with dies bonded to both interposers and embedded in molding material, reduces warpage and stress, allowing for easier bonding and reduced risk of delamination by maintaining smaller interposer sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a single large interposer is used to bond multiple semiconductor dies, then integration density is improved, but warpage and stress increase leading to cracking or delamination
Solution Approach 1:
The patent divides a single large interposer into multiple smaller interposers (first interposer, second interposer, third interposer, etc.). Each interposer bonds a subset of semiconductor dies. This segmentation reduces the size of each interposer, thereby minimizing warpage and stress while maintaining high integration density through the stacked configuration of multiple interposers.
Solution Approach 2:
The patent transitions from a single-plane interposer layout to a three-dimensional stacked configuration. Multiple interposers are arranged in different planes and stacked vertically, with lower interposers supporting upper interposers. This dimensional change allows high integration density without requiring a single large interposer, thus avoiding warpage and stress issues.
2Quantity of substance
If a single large interposer is used, then component density is improved, but manufacturing complexity increases due to warpage control difficulties
Solution Approach 1:
The patent segments the interposer structure into multiple smaller interposers arranged in a stack. Each interposer is smaller in size, making it easier to manufacture and control for warpage. The segmentation approach simplifies the manufacturing process by reducing the complexity associated with handling and bonding large interposers.
Solution Approach 2:
The patent employs a vertical stacking arrangement of multiple interposers in different planes. This three-dimensional configuration allows component density to be increased without requiring larger interposers, thereby avoiding the warpage control complexities that arise with large single-plane interposer designs.
3Reliability
If multiple smaller interposers are used, then warpage and stress are reduced, but device structure complexity increases
Solution Approach 1:
The patent utilizes vertical stacking of multiple interposers in different planes to achieve high integration density. While this creates a three-dimensional structure, the modular nature of the stacked interposers actually simplifies the overall design compared to a single large interposer, as each smaller interposer can be independently manufactured and bonded with reduced warpage concerns.
Solution Approach 2:
The patent implements a nested configuration where upper interposers are positioned on and supported by lower interposers in a stacked arrangement. This nesting approach organizes multiple interposers in a compact vertical structure, managing the complexity through hierarchical arrangement rather than horizontal expansion.
4Ease of manufacture
If multiple smaller interposers are used, then bonding ease is improved, but manufacturing steps increase
Solution Approach 1:
The patent divides the interposer system into multiple smaller, manageable units that can be independently processed and bonded. Each smaller interposer requires less precise alignment and bonding effort compared to a single large interposer, improving ease of manufacture despite the increased number of components.
Data Source
AI summary
A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.