Segmented Dam Structure for Resin Containment in Semiconductor Devices
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Solution Overview
Problem
In semiconductor devices using flip-chip mounting, the dispensing of liquid resin often results in resin flowing beyond the dam and onto electrode pads and side surfaces of the substrate, necessitating increased substrate size to prevent leakage, which complicates the integration of higher-density electronic components.
Innovation Solution
The use of a semiconductor device with a rectangular chip mounted on a substrate featuring a liquid resin layer and dams along the side surfaces of the chip, where the dams are strategically positioned and shaped to prevent resin flow, allowing for a smaller substrate size by utilizing surface tension to contain the resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the liquid resin is dispensed to cover side surfaces of the chip, then the resin fills the space between chip and substrate, but the resin flows beyond the dam to reach electrode pads and side surfaces of the substrate
Solution Approach 1:
The dam structure is divided into multiple segments: a first dam portion extending from the chip edge, a second dam portion extending from the first dam portion, and a third dam portion extending from the second dam portion. This segmentation allows the resin to be contained in stages, preventing leakage while maintaining precise filling control.
Solution Approach 2:
The dam structure extends not only in the lateral direction but also in the vertical direction with multiple dam portions at different heights or positions. This multi-dimensional approach creates a more effective containment barrier that prevents resin from flowing beyond the intended area.
2Object-affected harmful factors
If the distances L10 and L12 are increased to prevent resin flow, then the resin leakage is avoided, but the external size of the mounting substrate becomes greater
Solution Approach 1:
Instead of increasing the overall substrate size, the dam is segmented into multiple portions that extend outward from the chip edge. This allows effective resin containment with a more compact substrate footprint by concentrating the containment function in the dam structure rather than expanding the substrate boundaries.
Solution Approach 2:
The multi-portion dam acts as an intermediary structure between the chip and the substrate edge, providing resin containment without requiring increased distance between the chip and substrate boundaries. The dam mediates the resin flow control function, allowing compact substrate design.
3Quantity of substance
If a greater amount of liquid resin is dispensed for multi-layer chip mounting, then the resin fills gaps between multiple chips, but the external size of the mounting substrate must be increased further to prevent resin flow out
Solution Approach 1:
The dam is divided into multiple portions that create staged containment zones. This segmentation allows the increased amount of resin required for multi-layer chip mounting to be contained effectively without expanding the substrate size, as the multi-portion dam creates multiple barriers that trap the resin in the intended areas.
Solution Approach 2:
The dam structure serves as a temporary containment barrier that is disposed of or integrated into the final package. This allows the use of sufficient resin quantity for multi-layer mounting without permanent substrate expansion, as the dam provides the necessary containment function during the resin filling process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents resin leakage, enabling the formation of a sufficient resin layer even with multiple chip layers, maintaining a compact substrate size and ensuring uniform resin distribution without voids, thus supporting higher-density component integration.
Implementation Method 1
the resin is absorbed into a very small space between the chip 903 and the substrate 910 by capillarity to fill the space
Implementation Method 2
the dams are strategically positioned and shaped to prevent resin flow, allowing for a smaller substrate size by utilizing surface tension to contain the resin
Data Source
AI summary
The invention provides a semiconductor device including a rectangular chip provided on a mounting region of a substrate, a liquid resin layer provided under the rectangular chip and on a side surface of the chip, and a plurality of dams formed on the substrate so as to extend along the side surface of the rectangular chip. The configuration allows the semiconductor device to be provided with the substrate having a reduced size which is achieved by preventing a liquid resin from flowing out.