Semiconductor device
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Solution Overview
Problem
Current semiconductor devices face challenges in achieving higher performance and quality due to limitations in package structure design, which affect the reliability and conductivity of the semiconductor elements.
Innovation Solution
The semiconductor device incorporates a die pad with specific portions and a resin member that seals the semiconductor element, leads, and connecting members, where the leads entirely overlap with the resin member and are arranged along its outer edge, enhancing the structural integrity and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the die pad structure is modified to improve bonding stability, then the reliability of the semiconductor device is improved, but the device complexity increases
Solution Approach 1:
The die pad is divided into multiple portions (first portion, second portion, third portion, fourth portion) with different thicknesses and functions. The first portion has greater thickness for bonding stability, while the second portion has reduced thickness for heat dissipation, resolving the contradiction between structural complexity and functional performance.
Solution Approach 2:
Different portions of the die pad are designed with different thicknesses to provide localized functions: the first portion provides enhanced bonding stability with greater thickness, while the second portion provides improved heat dissipation with reduced thickness, avoiding the need to increase overall device complexity.
2Reliability
If the leads are arranged to entirely overlap with the resin member, then the conductivity and structural integrity are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The leads are pre-formed with specific overlapping arrangements relative to the resin member before final assembly. This preliminary positioning ensures that the leads maintain optimal conductivity paths while the molding process automatically maintains the required precision through the resin encapsulation.
Solution Approach 2:
The leads are arranged to be entirely overlapped by the resin member, creating a nested configuration where the resin encapsulates the leads. This nesting provides structural support and maintains precise positioning without requiring additional external fixtures or complex manufacturing steps.
3Stability of the object's composition
If the die pad portions are designed with different thicknesses to prevent deformation, then the stability during bonding is improved, but the device complexity increases
Solution Approach 1:
The die pad is segmented into four distinct portions with varying thicknesses, where the first and third portions have greater thickness for bonding stability, while the second and fourth portions have reduced thickness. This segmentation provides the necessary stability without requiring complex external support structures.
Solution Approach 2:
The die pad employs local quality variations through different thicknesses in different portions. The thicker first and third portions provide bonding stability where needed, while the thinner second and fourth portions reduce overall mass and complexity, achieving stability without uniform complexity throughout the structure.
Data Source
AI summary
A semiconductor device, includes: a semiconductor element having element main surface and element back surface spaced apart from each other in thickness direction and including a plurality of main surface electrodes arranged on the element main surface; a die pad having a die pad main surface where the semiconductor element is mounted; a plurality of leads including at least one first lead arranged on one side in first direction orthogonal to the thickness direction with respect to the die pad, and arranged around the die pad when viewed in the thickness direction; a plurality of connecting members including a first connecting member bonded to the at least one first lead, and configured to electrically connect the main surface electrodes and the leads; and a resin member configured to seal the semiconductor element, a part of the die pad, parts of the leads, and the connecting members.