Segmented 3D Die Stack Thermal Management via Lid Protrusion
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Solution Overview
Problem
Three-dimensional die stacks in electronic packages face thermal resistance issues due to the upper die obstructing heat flow, leading to increased internal temperatures and performance degradation.
Innovation Solution
A substrate with a first component and segmented second components forming a vacated region, where a thermal interface material (TIM) is applied on exposed surfaces, and a lid with protrusions overlays the components to enhance heat removal through the TIM, reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple dies are vertically stacked to increase bandwidth and function, then electrical interconnect density and system performance are improved, but thermal resistance increases and internal temperature rises
Solution Approach 1:
The upper die is segmented into multiple separate dies arranged in a grid pattern, creating void spaces between them. This segmentation allows heat to be extracted from multiple locations simultaneously through the TIM and cooling lid, rather than having to conduct through the entire upper die surface, thus reducing thermal resistance while maintaining the increased interconnect density provided by the stacked architecture.
2Productivity
If multiple dies are vertically stacked to increase electrical interconnect density, then system performance is improved, but thermal resistance along the primary heat flow path increases
Solution Approach 1:
The upper die is divided into multiple smaller dies with void spaces between them, creating multiple thermal pathways through the TIM to the cooling lid. This segmentation reduces the thermal resistance along the primary heat flow path by distributing heat extraction across multiple contact points, while the vertical stacking maintains high electrical interconnect density.
3Volume of moving object
If a complete functional unit is provided in a die stack for space-constrained environments, then space utilization is improved, but thermal management becomes more challenging
Solution Approach 1:
The upper die is segmented into multiple dies with void spaces, allowing the cooling lid to make thermal contact through these voids to multiple surfaces of the lower die and upper dies. This segmentation enables effective thermal management in the compact vertical stack configuration by creating multiple heat extraction pathways without increasing the overall package volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces thermal penalties by improving heat dissipation, limiting hot spots and maintaining system performance in computing environments.
Implementation Method 1
surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM
Data Source
AI summary
An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.