Segmented Hot Stamping Die Cooling for Complex Forming Surfaces
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Solution Overview
Problem
Conventional hot stamping dies face challenges in achieving effective cooling performance, especially when dealing with complex shapes, due to the difficulty in forming cooling channels close to the forming surface and the resulting poor cooling performance at overlapping surfaces between sub-assemblies.
Innovation Solution
The hot stamping die apparatus incorporates a design where cooling channels are formed close to the forming surface by machining grooves on the plates, with sealing grooves and O-rings for efficient sealing, and uses a zigzag flow path for cooling water to improve cooling efficiency and reduce pressure load, along with secondary cooling channels for enhanced cooling in complex areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling channels are formed by gun drilling in conventional dies, then the manufacturing process is simple, but the cooling performance is poor because the channels cannot be positioned close to the forming surface in complex geometries
Solution Approach 1:
The die is divided into multiple sub-assemblies, each with its own cooling channels formed close to the forming surface. This segmentation allows complex overall geometries to be broken down into manageable sections where gun drilling can effectively create cooling channels near the forming surface in each sub-assembly, thereby improving overall cooling performance while managing manufacturing complexity.
Solution Approach 2:
The patent introduces a new dimensional approach by creating overlapping surfaces between sub-assemblies that allow cooling channels to extend into the overlapping regions. This additional dimensional consideration enables cooling channels to be positioned closer to the forming surface in complex geometries by utilizing the third dimension of overlap depth, rather than being constrained to simple linear drilling paths.
2Shape
If the die has a three-dimensional complicated shape, then it can manufacture complex molded products, but it is not easy to shorten the distance from the forming surface to the cooling channel
Solution Approach 1:
The complicated three-dimensional die shape is segmented into multiple sub-assemblies, each maintaining the capability to form complex geometries while incorporating cooling channels close to their respective forming surfaces. This segmentation resolves the contradiction by allowing each sub-assembly to optimize cooling channel positioning independently, thereby maintaining complex shape capability while improving cooling performance.
Solution Approach 2:
Cooling channels are nested within the sub-assemblies in such a way that they extend into the overlapping surfaces between adjacent sub-assemblies. This nesting approach allows cooling channels to be embedded deep within the die structure near the forming surface, maintaining the complex three-dimensional shape capability while achieving superior cooling performance through proximity to the forming surface.
3Ease of manufacture
If sub-assemblies are assembled to form the die, then manufacturing flexibility is improved, but cooling performance at overlapping surfaces deteriorates
Solution Approach 1:
The patent merges the cooling channel systems of adjacent sub-assemblies by extending them into the overlapping surfaces between sub-assemblies. This merging ensures continuous cooling coverage across the interface regions, eliminating thermal discontinuities that would otherwise occur at assembly boundaries. The cooling channels are designed to flow continuously through overlapping regions, thereby maintaining uniform cooling performance while preserving the manufacturing flexibility benefits of modular assembly.
Solution Approach 2:
The patent applies local quality enhancement at overlapping surfaces by specifically designing cooling channels to extend into these regions with enhanced cooling capacity. The cooling channel configuration is locally optimized at interface regions to compensate for potential thermal discontinuities, ensuring uniform cooling performance across the entire die surface including overlapping areas, while maintaining the overall modular assembly structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for uniform and effective cooling of the forming surface, even with complicated shapes, improving productivity and quality by enhancing cooling performance and reducing assembly burdens.
Implementation Method 1
a first cooling channel 23 is formed on one surface 21 of the plate 20
Implementation Method 2
a zigzag flow path for cooling water to improve cooling efficiency
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
Provided is a hot stamping die apparatus including sub-assemblies constructed by making a plurality of plates erect and sequentially overlapping the plurality of plates in a face-to-face manner. A first cooling channel extending along overlapping surfaces is provided by forming grooves corresponding to each other on overlapping surfaces of adjacent plates, A second cooling channel passing through the corresponding sub-assembly in the length direction is provided in at least one of the sub-assemblies.