Segmented Display Cooling Structure for High Heat Density
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Solution Overview
Problem
As display devices become more advanced and compact, the heat generated by highly integrated electronic components leads to increased heat density, which can deteriorate the display quality and necessitates effective heat dissipation solutions.
Innovation Solution
The implementation of a display device with a heat dissipation member that includes a top plate, bottom plate, and heat dissipation fins, as well as heat dissipation terminals and lines, to efficiently dissipate heat from internal components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If display devices become more advanced and compact with highly integrated electronic components, then device functionality and integration are improved, but heat density increases causing deterioration of display quality
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat dissipation members (first heat dissipation member under the display panel, second heat dissipation member under the driver circuit board, third heat dissipation member under the control circuit board). Each member independently dissipates heat from specific high-heat-density components, allowing targeted heat management across different functional areas of the integrated device.
Solution Approach 2:
The patent transitions from conventional two-dimensional heat dissipation (single plane) to three-dimensional heat dissipation by placing heat dissipation members at multiple vertical levels (under display panel, driver circuit board, and control circuit board). This multi-layered approach increases the heat dissipation surface area and creates additional thermal conduction pathways in the vertical dimension.
2Temperature
If heat dissipation structures are added to manage heat density, then temperature control is improved, but device complexity increases
Solution Approach 1:
Each heat dissipation member serves multiple functions: it acts as a thermal conduction path from heat-generating components, provides a mounting structure for those components, and serves as a structural support element within the device assembly. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby limiting the increase in overall device complexity.
Solution Approach 2:
The patent merges the heat dissipation function with existing structural components (display panel, driver circuit board, control circuit board) by integrating heat dissipation members directly into these components. Rather than adding entirely separate heat dissipation systems, the thermal management function is combined with the structural and functional elements already present in the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated within the display device, improving its operational efficiency and reducing the risk of deterioration due to high heat density.
Implementation Method 1
a heat dissipation member disposed in at least one of the panel bottom member, the driver circuit board, or the control circuit board
Implementation Method 2
a plurality of heat dissipation fins connecting the top plate with the bottom plate
Implementation Method 3
a plurality of heat dissipation fins connecting the top plate with the bottom plate
Data Source
AI summary
A display device includes a display panel, a panel bottom member disposed under the display panel, a driver circuit board connected to the display panel, a control circuit board connected to the driver circuit board, and a heat dissipation member disposed in at least one of the panel bottom member, the driver circuit board, or the control circuit board.