Segmented Drain Layout for GaN HEMT Energy Loss Reduction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing III-V compound semiconductors, particularly gallium nitride-based materials, face challenges in reducing energy consumption and on-state resistance to meet the increasing demand for integration density in high electron mobility transistors.

Innovation Solution

A semiconductor device design featuring alternating first and second island structures with different potential configurations, including p-type semiconductor layers and metal electrodes, connected via drain vias, which create distinct potential differences and resistance values, reducing energy consumption and suppressing voltage overshoot.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional drain structures are used in gallium nitride-based high electron mobility transistors, then the device can maintain simple structure, but energy consumption is high and on-state resistance cannot be sufficiently reduced

Engineering Contradiction:
Improveenergy consumptionVSAvoiddrain structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The drain structure is segmented into multiple island structures (first and second island structures) with different potentials, arranged alternately along the second direction. This segmentation creates multiple current paths with different resistance values, allowing energy loss reduction through optimized current distribution while maintaining manageable structural complexity through systematic arrangement.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the drain structure are assigned different potentials and resistance characteristics. The first island structures have different potentials than the second island structures, creating local variations in electrical properties. This allows optimization of energy consumption in specific regions while maintaining overall device functionality.

Inventive Principle:
Principle #3Local quality

2Productivity

If higher integration density is achieved, then more devices can be packed, but energy consumption increases and on-state resistance becomes harder to control

Engineering Contradiction:
Improveintegration densityVSAvoidenergy consumption
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The drain is divided into multiple island structures that can be independently configured with different potentials and resistance values. This segmentation enables precise control of current distribution across the device, allowing high integration density to be achieved while maintaining optimized energy consumption through selective activation and resistance matching of individual island structures.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves lower energy consumption and improved reliability by minimizing energy loss and preventing damage from voltage spikes, while maintaining high power density and breakdown voltage.

Implementation Method 1

Each of the first island structures includes a p-type semiconductor layer and a first metal electrode over the p-type semiconductor layer

Methodology Applied
Scientific EffectSchottky barrier:

Data Source

PatentEP4716406A1Semiconductor device
Publication Date: 2026.03.25 HON HAI PRECISION INDUSTRY CO LTD
  • EP4716406A1 patent drawingFigure 1
  • EP4716406A1 patent drawingFigure 2
  • EP4716406A1 patent drawingFigure 3

AI summary

A semiconductor device includes a substrate structure (100), a source structure (110), a drain structure (120), and a gate structure (130). The source structure, the drain structure, and the gate structure are over the substrate structure and are arranged along a first direction (D1). The drain structure includes a plurality of first island structures (121) and a plurality of second island structures (122) arranged alternately and spaced apart along a second direction (D2). The second direction is substantially perpendicular to the first direction. Each of the first island structures includes a p-type semiconductor layer (121a) and a first metal electrode (121b) over the p-type semiconductor layer. Each of the second island structures (122) includes a second metal electrode (122a). In a conducting state, a potential of the first metal electrode of each of the first island structures is different from a potential of the second metal electrode of each of the second island structures.