Segmented Duct Assembly for Power Electronics Cooling
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Solution Overview
Problem
Existing cooling systems for power electronics in enclosures, such as those described in U.S. Pat. No. 6,935,419, have limitations in efficiency and cooling performance that need to be improved to effectively dissipate heat generated by power electronics.
Innovation Solution
A cooling system design featuring a duct assembly with a tapered first and second duct, a central passage, and heat sinks located in third and fourth ducts, where airflow is directed through a series of ducts to enhance heat transfer by creating turbulence and pressure, facilitating efficient heat dissipation from power electronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional cooling system with simple duct configuration is used, then the device complexity is low, but the heat dissipation efficiency and cooling performance are insufficient
Solution Approach 1:
The cooling system divides the airflow path into multiple segmented ducts (first duct, second duct, third duct, fourth duct) with distinct functions. Each duct segment handles specific airflow directions and cooling tasks, allowing optimized heat dissipation in each zone while maintaining overall system efficiency.
Solution Approach 2:
The patent introduces a vertical dimension to the duct configuration by positioning heat sinks in both horizontal and vertical orientations within the third and fourth ducts. This multi-dimensional arrangement maximizes surface area exposure to airflow and improves heat transfer efficiency without simply expanding the system footprint.
2Reliability
If airflow is directed through a series of ducts with heat sinks to enhance heat transfer, then the cooling performance improves, but the device complexity increases
Solution Approach 1:
The patent merges multiple airflow paths and heat sink arrangements into a unified duct assembly where the third and fourth ducts share common structural support and airflow source. This integration achieves enhanced cooling performance while avoiding the complexity of completely separate cooling systems.
Solution Approach 2:
The central passage serves multiple functions: it receives airflow from both the first and second ducts, distributes air to the third and fourth ducts, and provides structural support for the heat sinks. This multi-functionality reduces the need for additional dedicated components.
3Productivity
If heat sinks are positioned in multiple ducts to maximize heat transfer surface area, then the heat dissipation efficiency improves, but the manufacturing complexity increases
Solution Approach 1:
Heat sinks are strategically positioned in specific locations within the third and fourth ducts where airflow velocity and temperature conditions are optimal for heat transfer. This localized optimization maximizes heat dissipation efficiency without requiring heat sinks throughout the entire duct system, reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed cooling system enhances airflow and heat transfer efficiency, effectively dissipating heat from power electronics, thereby improving the overall cooling performance and efficiency compared to existing systems.
Implementation Method 1
airflow is directed through a series of ducts to enhance heat transfer by creating turbulence and pressure
Implementation Method 2
a plurality of heat sinks located in the third and fourth ducts
Data Source
AI summary
A cooling system may include a housing including an inlet; an outlet; a duct assembly between the inlet and the outlet; and at least one fan located to direct airflow from the inlet, through the duct assembly, and out the outlet; the duct assembly including: a first duct having an entrance facing the at least one fan and an exit normal to the entrance; a second duct having an entrance facing the at least one fan and an exit normal to the entrance; a central passage for receiving airflow from the first duct exit and the second duct exit; a third duct having an entrance fluidly coupled to the central passage; a fourth duct having an entrance fluidly coupled to the central passage; and a plurality of heat sinks located in the third and fourth ducts.