Segmented Electrode Plate for Uniform Circuit-Board Plating
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Solution Overview
Problem
Existing electroplating devices face issues with uneven electric field distribution due to inconsistent current supply to the anode electrode, leading to uneven film thickness on circuit boards, which affects reliability and quality.
Innovation Solution
The proposed solution involves an electrode plate with multiple electrode patterns and independent wirings connected to separate power modules, allowing for independent adjustment of the potential of each electrode pattern, thereby controlling the electric field distribution uniformly across the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single anode electrode receives current from a single rectifier, then the device structure is simple, but the electric field distribution becomes uneven leading to uneven film thickness
Solution Approach 1:
The electrode plate is divided into multiple electrode patterns (first, second, third electrode patterns) that are spatially separated and can be independently controlled. Each electrode pattern receives current through separate wirings from independent rectifiers, allowing independent adjustment of electric field strength in different regions to achieve uniform film thickness across the circuit board surface.
Solution Approach 2:
Different regions of the electrode plate are designed with different electrode patterns that have locally optimized geometries and positions. The first electrode pattern is positioned closer to the circuit board center, the second electrode pattern is positioned at intermediate distances, and the third electrode pattern is positioned farther away, creating locally adapted electric field distributions that collectively achieve uniform overall coverage.
2Manufacturing precision
If multiple electrode patterns with independent power modules are used, then the electric field distribution becomes even, but the device complexity increases
Solution Approach 1:
Multiple electrode patterns are integrated onto a single electrode plate substrate, combining multiple functional elements into one unified component. The first, second, and third electrode patterns are all mounted on the same plate with their wirings routed through the substrate, simplifying installation and assembly while maintaining the ability to independently control each electrode pattern's electric field.
3Area of stationary object
If electrode patterns are positioned at different distances from the circuit board, then electric field coverage is improved, but the structural complexity increases
Solution Approach 1:
The electrode patterns are arranged in a three-dimensional configuration with varying distances from the circuit board surface. The first electrode pattern is positioned closest to the circuit board, the second electrode pattern at an intermediate distance, and the third electrode pattern farthest away, creating a layered spatial arrangement that expands electric field coverage in the vertical dimension while maintaining controlled field strength distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that the electric fields formed by the electrode patterns are evenly distributed, resulting in an even metal film thickness on the circuit board, thereby enhancing the reliability and quality of the circuit board.
Implementation Method 1
an electric field is formed between same and the circuit board serving as a cathode, thereby electrolyzing the electroplating liquid and enabling the metal ions in the electroplating liquid to be separated out
Implementation Method 2
spraying an electroplating liquid having metal ions in an electroplating trough directly on a circuit board to be electroplated
Data Source
AI summary
An electrode plate and an electroplating device having the electrode plate is used as an anode electrode. The electrode plate includes a substrate, N electrode patterns and N wirings. The substrate has a first surface and a second surface opposite to each other and has a plurality of through holes. The N electrode patterns are disposed on the first surface of the substrate, and are spaced apart from each other. The N wirings are disposed on the second surface of the substrate. Each of the N wirings has a first end and a second end. The first end of the N wirings is connected to the corresponding N electrode patterns via at least one through hole. The second ends of the N wirings are used to connect to power modules respectively, wherein each of the N electrode patterns receives a current provided by a corresponding power module.