Segmented Outer Electrodes for Ceramic Electronic Components
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Solution Overview
Problem
Multilayer ceramic electronic components experience cracks due to stress accumulation in outer electrodes caused by the difference in coefficient of linear expansion between the ceramic body and the electrodes, especially under temperature changes.
Innovation Solution
A ceramic electronic component design featuring a ceramic body with outer electrodes comprising separate fired electrode layers and Cu plating layers, where the electrode layers are strategically positioned to avoid covering corner and edge portions, reducing stress accumulation and crack occurrence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If outer electrodes cover the end surfaces and extend onto principal surfaces and side surfaces, then electrical connectivity is improved, but stress accumulation occurs due to coefficient of linear expansion difference
Solution Approach 1:
The outer electrode is divided into multiple separate portions: a first portion on the end surface, a second portion on the first principal surface, a third portion on the second principal surface, a fourth portion on the first side surface, and a fifth portion on the second side surface. These portions are separated by intervals and do not continuously cover the ceramic body, thereby segmenting the electrode structure to reduce stress accumulation while maintaining electrical connectivity.
Solution Approach 2:
The electrode configuration varies by location: the first portion covers the end surface for electrical connection, while the second through fifth portions are positioned on principal and side surfaces at specific intervals. This local differentiation allows the electrode to provide connectivity where needed while avoiding continuous coverage that would cause stress concentration at corners and edges.
2Ease of manufacture
If heat treatment is performed on conductive paste to form outer electrodes, then electrode formation is achieved, but stress is accumulated due to thermal expansion differences
Solution Approach 1:
The conductive paste is applied in a segmented pattern that corresponds to the final electrode portions, with intervals between the first through fifth portions. This segmentation approach maintains ease of manufacture through conventional paste application while preventing stress accumulation during heat treatment by avoiding continuous electrode coverage.
3Reliability
If outer electrodes continuously cover the ceramic body surfaces, then electrical connectivity is improved, but crack occurrence increases under temperature changes
Solution Approach 1:
The outer electrode is configured as separate first through fifth portions with intervals between them, rather than continuous coverage. This segmentation reduces the harmful effect of stress concentration under temperature changes, preventing crack occurrence while maintaining sufficient electrical connectivity through the distributed electrode portions.
Solution Approach 2:
The intervals between the electrode portions act as intermediary regions that accommodate thermal expansion differences between the ceramic body and electrode material. These intermediate spaces prevent stress transmission that would otherwise lead to crack formation, while the electrode portions maintain electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces or prevents the occurrence of cracks in ceramic electronic components by distributing stress more evenly and preventing excessive strain on the ceramic body and electrode layers.
Implementation Method 1
The outer electrode further includes a Cu plating layer arranged to cover the first to fifth portions
Implementation Method 2
The outer electrodes that cover the end surfaces of the ceramic body are typically formed by applying conductive paste to the end surfaces of the ceramic body and then performing a heat treatment on the conductive paste
Data Source
AI summary
A ceramic electronic component includes a first fired electrode layer disposed on top of a ceramic body. The first fired electrode layer includes first to fifth portions that are separate from each other. The first portion is disposed on top of a first end surface. The second portion is disposed on top of a first principal surface. The third portion is disposed on top of a second principal surface. The fourth portion is disposed on top of a first side surface. The fifth portion is disposed on top of a second side surface.