Segmented EMI Shielding Structures for Compact Substrates
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Solution Overview
Problem
Conventional radio-frequency shielding structures for electronic devices are often bulky, limiting their effectiveness in compact applications and failing to adequately isolate radio-frequency circuitry from electromagnetic interference.
Innovation Solution
The use of electromagnetic shielding structures formed from insulating and conductive materials, including conductive foil, metals, and insulating materials like dielectric materials, which can be wrapped around substrates or formed using molding and cutting tools to create compartments and conductive layers, providing adjustable and temporary shielding options for sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional metal RF shielding cans are used to protect radio-frequency circuits from electromagnetic interference, then shielding effectiveness is improved, but device size and bulk increase
Solution Approach 1:
The patent divides the shielding structure into multiple segments: a base layer integrated with the substrate, vertical sidewalls extending from the base layer, and optional top coverage layers. This segmented approach allows the shielding to be distributed across different regions, providing effective EMI protection while conforming to the compact substrate geometry without requiring a single large enclosing can
Solution Approach 2:
The shielding structure is nested within the substrate footprint by integrating the base layer with the substrate and having sidewalls extend vertically from it. This nesting approach allows the shielding to occupy three-dimensional space within the existing device envelope, providing protection without increasing the overall device volume
Solution Approach 3:
The patent employs composite material structures combining conductive materials (for EMI shielding) with insulating materials (for electrical isolation). The base layer may be formed from conductive material, and insulating materials are used to electrically isolate the conductive shielding from underlying components, creating a composite structure that provides both shielding effectiveness and electrical safety in a compact form
2Object-affected harmful factors
If metal shielding cans are mounted on printed circuit boards to block radio-frequency signals, then electromagnetic shielding effectiveness is improved, but manufacturing complexity and assembly steps increase
Solution Approach 1:
The base layer of the shielding structure is merged with the substrate, eliminating the need for separate mounting operations. The shielding structure is formed as an integrated part of the substrate assembly, reducing the number of discrete components and simplifying both manufacturing and assembly processes while maintaining effective EMI protection
Solution Approach 2:
The shielding structure is formed during the substrate manufacturing process itself, with the base layer being patterned and formed along with the substrate. This preliminary formation of the shielding structure eliminates subsequent assembly steps that would be required for separately mounted shielding cans, reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These shielding structures effectively reduce electromagnetic interference, allowing for compact and efficient protection of electronic components from both internal and external sources of radio-frequency interference while enabling testing and assembly flexibility.
Implementation Method 1
The metal of the shielding cans blocks radio-frequency signals and helps shield the enclosed components from electromagnetic interference (EMI)
Implementation Method 2
Insulating materials (e.g., dielectric materials) may be used to provide structural support to the conductive layer and to help prevent electrical shorting between the conductive layer and underlying components that are being shielded
Data Source
AI summary
Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.