Segmented Fin Cooling Structure for Compact Devices

Solution Overview

Problem

Conventional cooling structures for heat sources in compact devices face challenges in enhancing cooling efficiency without increasing size and weight, and struggle to effectively cool components downstream of the heat releasing unit using the same airflow.

Innovation Solution

A cooling structure featuring a heat releasing unit with fins arranged in alternating pitch intervals, where a sirocco fan blows air through a first region with larger pitches to reduce air resistance and direct airflow to a second region with smaller pitches for enhanced heat dissipation, allowing efficient cooling of both the heat releasing unit and downstream components using a single fan.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If fins are arranged in a small pitch to expand heat dissipation area, then cooling efficiency of heat releasing unit is improved, but air resistance increases and cooling performance for downstream components deteriorates

Engineering Contradiction:

Improvecooling efficiency of heat releasing unitVSAvoidair resistance

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The heat releasing unit is divided into multiple regions with different fin pitches. The first region has larger fin pitches to reduce air resistance and allow sufficient airflow, while the second region has smaller fin pitches to maximize heat dissipation area. This segmentation allows each region to serve its specific function optimally.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different parts of the heat releasing unit have different fin pitch characteristics tailored to their specific needs. The first region (upstream) has larger pitches for airflow generation, while the second region (downstream) has smaller pitches for enhanced heat dissipation. This local differentiation optimizes both airflow and cooling performance.

Inventive Principle:

Principle #3Local quality

2Temperature

If a larger fan is used to improve cooling efficiency, then cooling performance is enhanced, but device size and weight increase

Engineering Contradiction:

Improvecooling efficiencyVSAvoiddevice weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The heat releasing unit is divided into multiple regions with different fin pitches. The first region has larger fin pitches to reduce air resistance and allow sufficient airflow, while the second region has smaller fin pitches to maximize heat dissipation area. This segmentation allows each region to serve its specific function optimally.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different parts of the heat releasing unit have different fin pitch characteristics tailored to their specific needs. The first region (upstream) has larger pitches for airflow generation, while the second region (downstream) has smaller pitches for enhanced heat dissipation. This local differentiation optimizes both airflow and cooling performance.

Inventive Principle:

Principle #3Local quality

3Temperature

If a larger fan is used to improve cooling efficiency, then cooling performance is enhanced, but device structure increases in size

Engineering Contradiction:

Improvecooling efficiencyVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The heat releasing unit is divided into multiple regions with different fin pitches. The first region has larger fin pitches to reduce air resistance and allow sufficient airflow, while the second region has smaller fin pitches to maximize heat dissipation area. This segmentation allows each region to serve its specific function optimally.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different parts of the heat releasing unit have different fin pitch characteristics tailored to their specific needs. The first region (upstream) has larger pitches for airflow generation, while the second region (downstream) has smaller pitches for enhanced heat dissipation. This local differentiation optimizes both airflow and cooling performance.

Inventive Principle:

Principle #3Local quality

4Temperature

If fins are arranged in a small pitch to expand heat dissipation area, then cooling efficiency is improved, but it becomes difficult to cool downstream components using the same airflow

Engineering Contradiction:

Improvecooling efficiency of heat releasing unitVSAvoidcooling capability for multiple components

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The heat releasing unit is divided into multiple regions with different fin pitches. The first region has larger fin pitches to reduce air resistance and allow sufficient airflow, while the second region has smaller fin pitches to maximize heat dissipation area. This segmentation allows each region to serve its specific function optimally.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different parts of the heat releasing unit have different fin pitch characteristics tailored to their specific needs. The first region (upstream) has larger pitches for airflow generation, while the second region (downstream) has smaller pitches for enhanced heat dissipation. This local differentiation optimizes both airflow and cooling performance.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances cooling efficiency by optimizing airflow distribution, reducing air resistance, and enabling effective cooling of multiple components with a compact design, while maintaining low production costs and minimizing noise.

Implementation Method 1

a method of putting a heat sink to the heat source to expand a heat releasing area

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

blowing cooling air onto a heat releasing unit

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

a method of arranging fins on a heat sink has been known as a method of expanding the contact area

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 4

a forcible cooling method of cooling the heat sink using a fan has also been adopted

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS9423677B2Cooling structure, image projection apparatus, electronic device, and cooling device

Publication Date: 2016.08.23 RICOH CO LTD

AI summary

A cooling structure includes: a heat releasing unit configured to include a plurality of fins and to release heat by contacting a first cooling target; and an air blowing unit configured to blow air to the heat releasing unit, wherein the heat releasing unit includes a first region and a second region in which intervals of the fins are smaller than those of the first region, and a second cooling target that is different from the first cooling target is positioned downstream relative to the first region in a flow path of the air, and the air that has passed through the first region blows on the second cooling target.